Issued Patents All Time
Showing 176–200 of 272 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7960263 | Amorphization/templated recrystallization method for hybrid orientation substrates | Katherine L. Saenger, Chun-Yung Sung, Haizhou Yin | 2011-06-14 |
| 7935612 | Layer transfer using boron-doped SiGe layer | Stephen W. Bedell, Daniel A. Inns, Jeehwan Kim, Devendra K. Sadana, James Vichiconti | 2011-05-03 |
| 7923849 | Interconnections for flip-chip using lead-free solders and having reaction barrier layers | Balaram Ghosal, Sung Kwon Kang, Stephen Kilpatrick, Paul A. Lauro, Henry A. Nye, III +2 more | 2011-04-12 |
| 7914619 | Thick epitaxial silicon by grain reorientation annealing and applications thereof | Joel P. de Souza, Daniel A. Inns, Devendra K. Sadana, Katherine L. Saenger | 2011-03-29 |
| 7897444 | Strained semiconductor-on-insulator (sSOI) by a simox method | Thomas N. Adam, Stephen W. Bedell, Joel P. de Souza, Alexander Reznicek, Devendra K. Sadana +1 more | 2011-03-01 |
| 7880241 | Low-temperature electrically activated gate electrode and method of fabricating same | John C. Arnold, Stephen W. Bedell, Devendra K. Sadana | 2011-02-01 |
| 7842940 | Structure and method to form semiconductor-on-pores (SOP) for high device performance and low manufacturing cost | Joel P. de Souza, Brian J. Greene, Devendra K. Sadana, Haining Yang | 2010-11-30 |
| 7823278 | Method for fabricating electrical contact buttons | Gareth G. Hougham, Joanna Rosner, Paul A. Lauro, Sherif A. Goma, Joseph Zinter | 2010-11-02 |
| 7816664 | Defect reduction by oxidation of silicon | Stephen W. Bedell, Huajie Chen, Anthony G. Domenicucci, Devendra K. Sadana | 2010-10-19 |
| 7772096 | Formation of SOI by oxidation of silicon with engineered porosity gradient | Joel P. Desouza, Alexander Reznicek, Devendra K. Sadana | 2010-08-10 |
| 7736152 | Land grid array fabrication using elastomer core and conducting metal shell or mesh | Gareth G. Hougham, Paul A. Lauro, Joseph Zinter | 2010-06-15 |
| 7718231 | Thin buried oxides by low-dose oxygen implantation into modified silicon | Kwang Su Choe, Siegfried Maurer, Ryan Mitchell, Devendra K. Sadana | 2010-05-18 |
| 7704852 | Amorphization/templated recrystallization method for hybrid orientation substrates | Katherine L. Saenger, Chun-Yung Sung, Haizhou Yin | 2010-04-27 |
| 7691733 | Laser processing method for trench-edge-defect-free solid phase epitaxy in confined geometrics | Kam-Leung Lee, Katherine L. Saenger, Chun-Yung Sung, Haizhou Yin | 2010-04-06 |
| 7679141 | High-quality SGOI by annealing near the alloy melting point | Stephen W. Bedell, Huajie Chen, Anthony G. Domenicucci, Richard J. Murphy, Devendra K. Sadana | 2010-03-16 |
| 7648369 | Interposer with electrical contact button and method | Gareth G. Hougham, Joanna Rosner, Paul A. Lauro, Sherif A. Goma, Joseph Zinter | 2010-01-19 |
| 7592671 | Strained silicon-on-insulator by anodization of a buried p+ silicon germanium layer | Thomas N. Adam, Stephen W. Bedell, Joel P. de Souza, Alexander Reznicek, Devendra K. Sadana +1 more | 2009-09-22 |
| 7566482 | SOI by oxidation of porous silicon | Kwang Su Choe, Devendra K. Sadana | 2009-07-28 |
| 7550369 | Method for fabricating low-defect-density changed orientation Si | Joel P. de Souza, John A. Ott, Devendra K. Sadana, Katherine L. Saenger | 2009-06-23 |
| 7547616 | Laser processing method for trench-edge-defect-free solid phase epitaxy in confined geometrics | Kam-Leung Lee, Katherine L. Saenger, Chun-Yung Sung, Haizhou Yin | 2009-06-16 |
| 7538565 | High density integrated circuit apparatus, test probe and methods of use thereof | Brian S. Beaman, Paul A. Lauro, Maurice Heathcote Norcott, Da-Yuan Shih, George F. Walker | 2009-05-26 |
| 7507988 | Semiconductor heterostructure including a substantially relaxed, low defect density SiGe layer | Stephen W. Bedell, Huajie Chen, Anthony G. Domenicucci, Devendra K. Sadana | 2009-03-24 |
| 7501318 | Formation of silicon-germanium-on-insulator (SGOI) by an integral high temperature SIMOX-Ge interdiffusion anneal | Stephen W. Bedell, Devendra K. Sadana, Ghavam G. Shahidi | 2009-03-10 |
| 7495342 | Angled flying lead wire bonding process | Brian S. Beaman, Paul A. Lauro, Da-Yuan Shih | 2009-02-24 |
| 7485539 | Strained semiconductor-on-insulator (sSOI) by a simox method | Thomas N. Adam, Stephen W. Bedell, Joel P. de Souza, Alexander Reznicek, Devendra K. Sadana +1 more | 2009-02-03 |