Issued Patents All Time
Showing 151–175 of 272 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8753528 | Etchant for controlled etching of Ge and Ge-rich silicon germanium alloys | Stephen W. Bedell, Nicolas Daval | 2014-06-17 |
| 8754666 | Probe structure having a plurality of discrete insulated probe tips projecting from a support surface, apparatus for use thereof and methods of fabrication thereof | Brian S. Beaman, Paul A. Lauro, Yun-Hsin Liao, Daniel Peter Morris, Da-Yuan Shih | 2014-06-17 |
| 8748296 | Edge-exclusion spalling method for improving substrate reusability | Stephen W. Bedell, Paul A. Lauro, Devendra K. Sadana, Davood Shahrjerdi, Norma E. Sosa Cortes | 2014-06-10 |
| 8735210 | High efficiency solar cells fabricated by inexpensive PECVD | Augustin J. Hong, Jeehwan Kim, Devendra K. Sadana | 2014-05-27 |
| 8709914 | Method for controlled layer transfer | Stephen W. Bedell, Paul A. Lauro, Devendra K. Sadana | 2014-04-29 |
| 8709957 | Spalling utilizing stressor layer portions | Stephen W. Bedell, Paul A. Lauro, Ning Li, Devendra K. Sadana, Ibrahim Alhomoudi | 2014-04-29 |
| 8703521 | Multijunction photovoltaic cell fabrication | Stephen W. Bedell, Norma E. Sosa Cortes, Devendra K. Sadana, Davood Shahrjerdi | 2014-04-22 |
| 8680393 | Thin film solar cells | Nestor A. Bojarczuk, Supratik Guha, Byungha Shin | 2014-03-25 |
| 8679943 | Fixed curvature force loading of mechanically spalled films | Stephen W. Bedell, Paul A. Lauro, Xiao Hu Liu, Devendra K. Sadana | 2014-03-25 |
| 8659110 | Single-junction photovoltaic cell | Stephen W. Bedell, Devendra K. Sadana, Davood Shahrjerdi, Norma E. Sosa Cortes, Brent A. Wacaser | 2014-02-25 |
| 8642378 | Field-effect inter-digitated back contact photovoltaic device | Bahman Hekmatshoartabari, Devendra K. Sadana, Ghavam G. Shahidi, Davood Shahrjerdi | 2014-02-04 |
| 8633097 | Single-junction photovoltaic cell | Stephen W. Bedell, Norma E. Sosa Cortes, Devendra K. Sadana, Davood Shahrjerdi, Brent A. Wacaser | 2014-01-21 |
| 8491772 | Redox method of forming a coaxial probe structure of elongated electrical conductors projecting from a support structure | Brian S. Beaman, Paul A. Lauro, Yun-Hsin Liao, Daniel Peter Morris, Da-Yuan Shih | 2013-07-23 |
| 8486250 | Electrodeposition method of forming a probe structure having a plurality of discrete insulated probe tips projecting from a support surface | Brian S. Beaman, Paul A. Lauro, Yun-Hsin Liao, Daniel Peter Morris, Da-Yuan Shih | 2013-07-16 |
| 8450184 | Thin substrate fabrication using stress-induced spalling | Stephen W. Bedell, Paul A. Lauro, Devendra K. Sadana | 2013-05-28 |
| 8431476 | Method to prevent surface decomposition of III-V compound semiconductors | Joel P. de Souza, Edward W. Kiewra, Steven J. Koester, Christopher C. Parks, Devendra K. Sadana +1 more | 2013-04-30 |
| 8415772 | Method to prevent surface decomposition of III-V compound semiconductors | Joel P. de Souza, Edward W. Kiewra, Steven J. Koester, Christopher C. Parks, Devendra K. Sadana +1 more | 2013-04-09 |
| 8361889 | Strained semiconductor-on-insulator by addition and removal of atoms in a semiconductor-on-insulator | Thomas N. Adam, Stephen W. Bedell, Joel P. de Souza, Alexander Reznicek, Devendra K. Sadana +1 more | 2013-01-29 |
| 8298923 | Germanium-containing release layer for transfer of a silicon layer to a substrate | Stephen W. Bedell, Daniel A. Inns, Jeehwan Kim, Devendra K. Sadana, Katherine L. Saenger | 2012-10-30 |
| 8273649 | Method to prevent surface decomposition of III-V compound semiconductors | Joel P. de Souza, Edward W. Kiewra, Steven J. Koester, Christopher C. Parks, Devendra K. Sadana +1 more | 2012-09-25 |
| 8247261 | Thin substrate fabrication using stress-induced substrate spalling | Stephen W. Bedell, Paul A. Lauro, Devendra K. Sadana | 2012-08-21 |
| 8227792 | Relaxed low-defect SGOI for strained SI CMOS applications | Paul D. Agnello, Stephen W. Bedell, Robert H. Dennard, Anthony G. Domenicucci, Devendra K. Sadana | 2012-07-24 |
| 8053759 | Ion implantation for suppression of defects in annealed SiGe layers | Stephen W. Bedell, Huajie Chen, Devendra K. Sadana, Ghavam G. Shahidi | 2011-11-08 |
| 8026613 | Interconnections for flip-chip using lead-free solders and having reaction barrier layers | Balaram Ghosal, Sung Kwon Kang, Stephen Kilpatrick, Paul A. Lauro, Henry A. Nye, III +2 more | 2011-09-27 |
| 7967062 | Thermally conductive composite interface, cooled electronic assemblies employing the same, and methods of fabrication thereof | Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Roger R. Schmidt +1 more | 2011-06-28 |