Issued Patents All Time
Showing 26–38 of 38 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6661100 | Low impedance power distribution structure for a semiconductor chip package | Brent A. Anderson, Randolph F. Knarr, Sarah H. Knickerbocker, Edmund J. Sprogis | 2003-12-09 |
| 6622907 | Sacrificial seed layer process for forming C4 solder bumps | Lisa A. Fanti, Randolph F. Knarr, Erik J. Roggeman | 2003-09-23 |
| 6531069 | Reactive Ion Etching chamber design for flip chip interconnections | Peter C. Wade, William Brearley, Jonathan H. Griffith | 2003-03-11 |
| 6479884 | Interim oxidation of silsesquioxane dielectric for dual damascene process | Robert Cook, Stephen E. Greco, John P. Hummel, Joyce C. Liu, Vincent J. McGahay +1 more | 2002-11-12 |
| 6348736 | In situ formation of protective layer on silsesquioxane dielectric for dual damascene process | Vincent J. McGahay, John P. Hummel, Joyce C. Liu, Rebecca D. Mih, Robert Cook +1 more | 2002-02-19 |
| 6329280 | Interim oxidation of silsesquioxane dielectric for dual damascene process | Robert Cook, Stephen E. Greco, John P. Hummel, Joyce C. Liu, Vincent J. McGahay +1 more | 2001-12-11 |
| 6293457 | Integrated method for etching of BLM titanium-tungsten alloys for CMOS devices with copper metallization | Jonathan H. Griffith, Mary Cullinan-Scholl, William Brearley, Peter C. Wade | 2001-09-25 |
| 6221780 | Dual damascene flowable oxide insulation structure and metallic barrier | Stephen E. Greco, John P. Hummel, Joyce C. Liu, Vincent J. McGahay, Rebecca D. Mih | 2001-04-24 |
| 5800626 | Control of gas content in process liquids for improved megasonic cleaning of semiconductor wafers and microelectronics substrates | Susan L. Cohen, Emmanuel I. Cooper, Klaus Penner, David L. Rath | 1998-09-01 |
| 5251806 | Method of forming dual height solder interconnections | Birendra Agarwala, Aziz Mohammad Ahsan, Arthur Bross, Mark F. Chadurjian, Nicholas G. Koopman +8 more | 1993-10-12 |
| 5225711 | Palladium enhanced soldering and bonding of semiconductor device contacts | Chin-An Chang, Nicholas G. Koopman, Judith Marie Roldan, Steven Strickman, Helen L. Yeh | 1993-07-06 |
| 5130779 | Solder mass having conductive encapsulating arrangement | Birendra Agarwala, Aziz Mohammad Ahsan, Arthur Bross, Mark F. Chadurjian, Nicholas G. Koopman +8 more | 1992-07-14 |
| 5048744 | Palladium enhanced fluxless soldering and bonding of semiconductor device contacts | Chin-An Chang, Nicholas G. Koopman, Judith Marie Roldan, Steven Strickman, Helen L. Yeh | 1991-09-17 |