Issued Patents All Time
Showing 326–350 of 496 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9577096 | Salicide formation on replacement metal gate finFet devices | Soon-Cheon Seo, Tenko Yamashita, Chun-Chen Yeh | 2017-02-21 |
| 9576096 | Semiconductor structures including an integrated finFET with deep trench capacitor and methods of manufacture | Kevin K. Chan, Sivananda K. Kanakasabapathy, Babar A. Khan, Masaharu Kobayashi, Theodorus E. Standaert +1 more | 2017-02-21 |
| 9570554 | Robust gate spacer for semiconductor devices | Tenko Yamashita | 2017-02-14 |
| 9570449 | Metal strap for DRAM/FinFET combination | — | 2017-02-14 |
| 9564526 | Group III nitride integration with CMOS technology | Can Bayram, Christopher P. D'Emic, William J. Gallagher, Devendra K. Sadana | 2017-02-07 |
| 9564506 | Low end parasitic capacitance FinFET | — | 2017-02-07 |
| 9553166 | Asymmetric III-V MOSFET on silicon substrate | Cheng-Wei Cheng, Pranita Kerber, Amlan Majumdar, Renee T. Mo, Yanning Sun | 2017-01-24 |
| 9553107 | Shallow extension junction | Kevin K. Chan, Pouya Hashemi, Dae-Gyu Park, Min Yang | 2017-01-24 |
| 9548358 | Dual fill silicon-on-nothing field effect transistor | — | 2017-01-17 |
| 9548421 | Optoelectronic devices with back contact | Ning Li, Tak H. Ning, Jean-Olivier Plouchart, Devendra K. Sadana | 2017-01-17 |
| 9543463 | Signal distribution in integrated circuit using optical through silicon via | James D. Warnock, Dieter Wendel | 2017-01-10 |
| 9536832 | Junctionless back end of the line via contact | — | 2017-01-03 |
| 9536775 | Aspect ratio for semiconductor on insulator | — | 2017-01-03 |
| 9536739 | Self-cut sidewall image transfer process | — | 2017-01-03 |
| 9530665 | Protective trench layer and gate spacer in finFET devices | Richard S. Wise | 2016-12-27 |
| 9525069 | Structure and method to form a FinFET device | Andres Bryant, Jeffrey B. Johnson, Tenko Yamashita | 2016-12-20 |
| 9515165 | III-V field effect transistor (FET) with reduced short channel leakage, integrated circuit (IC) chip and method of manufacture | Cheng-Wei Cheng, Pranita Kerber, Amlan Majumdar | 2016-12-06 |
| 9515090 | Method to form dual channel group III-V and Si/Ge FINFET CMOS and integrated circuit fabricated using the method | Daniele Caimi, Lukas Czornomaz, Jean Fompeyrine | 2016-12-06 |
| 9515070 | Replacement metal gate | David V. Horak, Stefan Schmitz, Junli Wang | 2016-12-06 |
| 9508833 | Punch through stopper for semiconductor device | Tenko Yamashita | 2016-11-29 |
| 9502506 | Structure for FinFET fins | Tenko Yamashita | 2016-11-22 |
| 9502500 | Forming multi-stack nanowires using a common release material | — | 2016-11-22 |
| 9496447 | Signal distribution in integrated circuit using optical through silicon via | James D. Warnock, Dieter Wendel | 2016-11-15 |
| 9496399 | FinFET devices with multiple channel lengths | Tenko Yamashita | 2016-11-15 |
| 9496379 | Method and structure for III-V FinFET | — | 2016-11-15 |