DS

Dominic J. Schepis

IBM: 112 patents #469 of 70,183Top 1%
Globalfoundries: 29 patents #87 of 4,424Top 2%
AM AMD: 1 patents #5,683 of 9,279Top 65%
GU Globalfoundries U.S.: 1 patents #344 of 665Top 55%
📍 Wappingers Falls, NY: #8 of 884 inventorsTop 1%
🗺 New York: #278 of 115,490 inventorsTop 1%
Overall (All Time): #7,089 of 4,157,543Top 1%
141
Patents All Time

Issued Patents All Time

Showing 76–100 of 141 patents

Patent #TitleCo-InventorsDate
7759213 Pattern independent Si:C selective epitaxy Abhishek Dube, Ashima B. Chakravarti 2010-07-20
7682915 Pre-epitaxial disposable spacer integration scheme with very low temperature selective epitaxy for enhanced device performance Huajie Chen, Judson R. Holt, Kern Rim 2010-03-23
7622341 Sige channel epitaxial development for high-k PFET manufacturability Michael P. Chudzik, Linda Black 2009-11-24
7544994 Semiconductor structure with multiple fins having different channel region heights and method of forming the semiconductor structure Huilong Zhu 2009-06-09
7446005 Manufacturable recessed strained RSD structure and process for advanced CMOS Brian W. Messenger, Renee T. Mo 2008-11-04
7446350 Embedded silicon germanium using a double buried oxide silicon-on-insulator wafer Huajie Chen, Dureseti Chidambarrao, Henry K. Utomo 2008-11-04
7381623 Pre-epitaxial disposable spacer integration scheme with very low temperature selective epitaxy for enhanced device performance Huajie Chen, Judson R. Holt, Kern Rim 2008-06-03
RE40339 Silicon-on-insulator chip having an isolation barrier for reliability Ronald J. Bolam, Subhash B. Kulkami 2008-05-27
7348633 Hybrid crystallographic surface orientation substrate having one or more SOI regions and/or bulk semiconductor regions Junedong Lee, Devendra K. Sadana, Ghavam G. Shahidi 2008-03-25
7183573 Disposable spacer for symmetric and asymmetric Schottky contact to SOI mosfet Andres Bryant, Jerome B. Lasky, Effendi Leobandung 2007-02-27
7166521 SOI wafers with 30-100 Å buried oxide (BOX) created by wafer bonding using 30-100 Å thin oxide as bonding layer Diane C. Boyd, Hussein I. Hanafi, Erin C. Jones, Leathen Shi 2007-01-23
7163866 SOI MOSFETS exhibiting reduced floating-body effects Fariborz Assaderaghi, Werner Rausch, Ghavam G. Shahidi 2007-01-16
7115463 Patterning SOI with silicon mask to create box at different depths Devendra K. Sadana, Michael D. Steigerwalt 2006-10-03
7115955 Semiconductor device having a strained raised source/drain Brian W. Messenger, Renee T. Mo 2006-10-03
6900092 Surface engineering to prevent epi growth on gate poly during selective epi processing Atul Ajmera, Michael D. Steigerwalt 2005-05-31
6891228 CMOS device on ultrathin SOI with a deposited raised source/drain, and a method of manufacture Heemyong Park, Byoung Hun Lee, Paul D. Agnello, Ghavam G. Shahidi 2005-05-10
6884667 Field effect transistor with stressed channel and method for making same Bruce B. Doris, Dureseti Chidambarrao, Xavier Baie, Jack A. Mandelman, Devendra K. Sadana 2005-04-26
6835633 SOI wafers with 30-100 å buried oxide (BOX) created by wafer bonding using 30-100 å thin oxide as bonding layer Diane C. Boyd, Hussein I. Hanafi, Erin C. Jones, Leathen Shi 2004-12-28
6828630 CMOS device on ultrathin SOI with a deposited raised source/drain, and a method of manufacture Heemyong Park, Byoung Hun Lee, Paul D. Agnello, Ghavam G. Shahidi 2004-12-07
6808974 CMOS structure with maximized polysilicon gate activation and a method for selectively maximizing doping activation in gate, extension, and source/drain regions Heemyong Park, Fariborz Assaderaghi 2004-10-26
6717216 SOI based field effect transistor having a compressive film in undercut area under the channel and a method of making the device Bruce B. Doris, Dureseti Chidambarrao, Xavier Baie, Jack A. Mandelman, Devendra K. Sadana 2004-04-06
6686629 SOI MOSFETS exhibiting reduced floating-body effects Fariborz Assaderaghi, Werner Rausch, Ghavam G. Shahidi 2004-02-03
6645795 Polysilicon doped transistor using silicon-on-insulator and double silicon-on-insulator K. Paul Muller, Ghavam G. Shahidi 2003-11-11
6602759 Shallow trench isolation for thin silicon/silicon-on-insulator substrates by utilizing polysilicon Atul Ajmera, Klaus D. Beyer 2003-08-05
6599813 Method of forming shallow trench isolation for thin silicon-on-insulator substrates Klaus D. Beyer 2003-07-29