EJ

Erin C. Jones

IBM: 28 patents #3,676 of 70,183Top 6%
Overall (All Time): #139,793 of 4,157,543Top 4%
28
Patents All Time

Issued Patents All Time

Showing 25 most recent of 28 patents

Patent #TitleCo-InventorsDate
7960790 Self-aligned planar double-gate transistor structure Omer H. Dokumaci, Bruce B. Doris, Kathryn Guarini, Suryanararyan G. Hegde, Meikei Ieong 2011-06-14
7741165 Polycrystalline SiGe Junctions for advanced devices Kevin K. Chan, Robert J. Miller, Atul Ajmera 2010-06-22
7713837 Low temperature fusion bonding with high surface energy using a wet chemical treatment Kevin K. Chan, Kathryn Guarini, Antonio F. Saavedra, Jr., Leathen Shi, Dinkar Singh 2010-05-11
7566631 Low temperature fusion bonding with high surface energy using a wet chemical treatment Kevin K. Chan, Kathryn Guarini, Antonio F. Saavedra, Jr., Leathen Shi, Dinkar Singh 2009-07-28
7453123 Self-aligned planar double-gate transistor structure Omer H. Dokumaci, Bruce B. Doris, Kathryn Guarini, Suryanarayan G. Hegde, Meikei Ieong 2008-11-18
7387924 Polycrystalline SiGe junctions for advanced devices Kevin K. Chan, Robert J. Miller, Atul Ajmera 2008-06-17
7361556 Method of fabricating semiconductor side wall fin James W. Adkisson, Paul D. Agnello, Arne Ballantine, Rama Divakaruni, Edward J. Nowak +1 more 2008-04-22
7265417 Method of fabricating semiconductor side wall fin James W. Adkisson, Paul D. Agnello, Arne Ballantine, Rama Divakaruni, Edward J. Nowak +1 more 2007-09-04
7205185 Self-aligned planar double-gate process by self-aligned oxidation Omer H. Dokumaci, Bruce B. Doris, Kathryn Guarini, Suryanarayan G. Hegde, Meikei Ieong 2007-04-17
7166521 SOI wafers with 30-100 Å buried oxide (BOX) created by wafer bonding using 30-100 Å thin oxide as bonding layer Diane C. Boyd, Hussein I. Hanafi, Dominic J. Schepis, Leathen Shi 2007-01-23
7163864 Method of fabricating semiconductor side wall fin James W. Adkisson, Paul D. Agnello, Arne Ballantine, Rama Divakaruni, Edward J. Nowak +1 more 2007-01-16
7135391 Polycrystalline SiGe junctions for advanced devices Kevin K. Chan, Rober J. Miller, Atul Ajmera 2006-11-14
7112845 Double gate trench transistor James W. Adkisson, Paul D. Agnello, Arne Ballantine, Rama Divakaruni, Jed H. Rankin 2006-09-26
6835633 SOI wafers with 30-100 å buried oxide (BOX) created by wafer bonding using 30-100 å thin oxide as bonding layer Diane C. Boyd, Hussein I. Hanafi, Dominic J. Schepis, Leathen Shi 2004-12-28
6833569 Self-aligned planar double-gate process by amorphization Omer H. Dokumaci, Bruce B. Doris, Suryanarayan G. Hegde, Meikei Ieong 2004-12-21
6797553 Method for making multiple threshold voltage FET using multiple work-function gate materials James W. Adkisson, Arne Ballantine, Ramachandra Divakaruni, Jeffrey B. Johnson, Hon-Sum Philip Wong 2004-09-28
6762101 Damascene double-gate FET Kevin K. Chan, Paul M. Solomon, Hon-Sum Philip Wong 2004-07-13
6686630 Damascene double-gate MOSFET structure and its fabrication method Hussein I. Hanafi, Cheruvu Murthy, Philip J. Oldiges, Leathen Shi 2004-02-03
6579614 Structure having refractory metal film on a substrate Kevin K. Chan, Fenton R. McFeely, Paul M. Solomon, John J. Yurkas 2003-06-17
6580132 Damascene double-gate FET Kevin K. Chan, Paul M. Solomon, Hon-Sum Philip Wong 2003-06-17
6472258 Double gate trench transistor James W. Adkisson, Paul D. Agnello, Arne Ballantine, Rama Divakaruni, Jed H. Rankin 2002-10-29
6448590 Multiple threshold voltage FET using multiple work-function gate materials James W. Adkisson, Arne Ballantine, Ramachandra Divakaruni, Jeffrey B. Johnson, Hon-Sum Philip Wong 2002-09-10
6406962 Vertical trench-formed dual-gate FET device structure and method for creation Paul D. Agnello, Arne Ballantine, Ramachandra Divakaruni, Edward J. Nowak, Jed H. Rankin 2002-06-18
6339002 Method utilizing CMP to fabricate double gate MOSFETS with conductive sidewall contacts Kevin K. Chan, Paul M. Solomon 2002-01-15
6333247 Two-step MOSFET gate formation for high-density devices Kevin K. Chan, Paul M. Solomon 2001-12-25