Issued Patents All Time
Showing 51–75 of 132 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8865597 | Ta—TaN selective removal process for integrated device fabrication | John M. Cotte, Nils D. Hoivik, Robert L. Wisnieff | 2014-10-21 |
| 8796138 | Through substrate vias | John M. Cotte, Bucknell C. Webb | 2014-08-05 |
| 8739096 | Micro-electro-mechanical structure (MEMS) capacitor devices, capacitor trimming thereof and design structures | Anthony K. Stamper | 2014-05-27 |
| 8709264 | Planar cavity MEMS and related structures, methods of manufacture and design structures | Anthony K. Stamper | 2014-04-29 |
| 8692276 | Parallel optical transceiver module | Fuad E. Doany, Clint L. Schow, Mehmet Soyuer, Alexander V. Rylyakov | 2014-04-08 |
| 8685778 | Planar cavity MEMS and related structures, methods of manufacture and design structures | Anthony K. Stamper | 2014-04-01 |
| 8541854 | Method of minimizing beam bending of MEMS device by reducing the interfacial bonding strength between sacrificial layer and MEMS structure | John M. Cotte, Nils D. Hoivik, Minhua Lu, Hongqing Zhang | 2013-09-24 |
| 8536610 | Parallel optical transceiver module | Fuad E. Doany, Clint L. Schow, Mehmet Soyuer, Alexander V. Rylyakov | 2013-09-17 |
| 8448790 | Surface charge enabled nanoporous semi-permeable membrane for desalination | John M. Cotte, Hongbo Peng, Stephen M. Rossnagel | 2013-05-28 |
| 8426316 | Ta-TaN selective removal process for integrated device fabrication | John M. Cotte, Nils D. Hoivik, Robert L. Wisnieff | 2013-04-23 |
| 8399292 | Fabricating a semiconductor chip with backside optical vias | Fuad E. Doany, Clint L. Schow, Mehmet Soyuer, Alexander V. Rylyakov | 2013-03-19 |
| 8307994 | Surface charge enabled nanoporous semi-permeable membrane for desalination | John M. Cotte, Hongbo Peng, Stephen M. Rossnagel | 2012-11-13 |
| 8269291 | Low temperature Bi-CMOS compatible process for MEMS RF resonators and filters | Leena Paivikki Buchwalter, Kevin K. Chan, Timothy J. Dalton, Jennifer Lund, Kevin Shawn Petraraca +2 more | 2012-09-18 |
| 8263492 | Through substrate vias | John M. Cotte, Bucknell C. Webb | 2012-09-11 |
| 8241957 | Negative thermal expansion system (NTES) device for TCE compensation in elastomer composites and conductive elastomer interconnects in microelectronic packaging | Gareth G. Hougham, S. Jay Chey, James P. Doyle, Xiao Hu Liu, Paul A. Lauro +2 more | 2012-08-14 |
| 8163584 | Method of minimizing beam bending of MEMS device by reducing the interfacial bonding strength between sacrificial layer and MEMS structure | Minhua Lu, Nils D. Hoivik, John M. Cotte, Hongqing Zhang | 2012-04-24 |
| 8029716 | Amorphous nitride release layers for imprint lithography, and method of use | Frances Anne Houle, Simone Raoux, Stephen M. Rossnagel | 2011-10-04 |
| 8008095 | Methods for fabricating contacts to pillar structures in integrated circuits | Solomon Assefa, Gregory Costrini, Michael J. Rooks, Jonathan Zanhong Sun | 2011-08-30 |
| 7943412 | Low temperature Bi-CMOS compatible process for MEMS RF resonators and filters | Leena Paivikki Buchwalter, Kevin K. Chan, Timothy J. Dalton, Jennifer Lund, Kevin S. Petrarca +2 more | 2011-05-17 |
| 7883919 | Negative thermal expansion system (NTEs) device for TCE compensation in elastomer compsites and conductive elastomer interconnects in microelectronic packaging | Gareth G. Hougham, S. Jay Chey, James P. Doyle, Xiao Hu Liu, Paul A. Lauro +2 more | 2011-02-08 |
| 7863070 | Methods for encapsulating microelectromechanical (MEM) devices on a wafer scale | Evan G. Colgan, Bruce K. Furman | 2011-01-04 |
| 7808798 | Versatile Si-based packaging with integrated passive components for mmWave applications | John M. Cotte, Brian P. Gaucher, Janusz Grzyb, Nils D. Hoivik, John U. Knickerbocker +5 more | 2010-10-05 |
| 7738753 | CMOS compatible integrated dielectric optical waveguide coupler and fabrication | Solomon Assefa, Yurii A. Vlasov | 2010-06-15 |
| 7581314 | Method of forming noble metal contacts | Hariklia Deligianni, Panayotis Andricacos, L. Paivikki Buchwalter, John M. Cotte, Mahadevaiyer Krishnan +5 more | 2009-09-01 |
| 7556979 | Negative thermal expansion system (NTEs) device for TCE compensation in elastomer composites and conductive elastomer interconnects in microelectronic packaging | Gareth G. Hougham, S. Jay Chey, James P. Doyle, Xiao Hu Liu, Paul A. Lauro +2 more | 2009-07-07 |