Issued Patents All Time
Showing 51–67 of 67 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6811470 | Methods and compositions for chemical mechanical polishing shallow trench isolation substrates | Benjamin A. Bonner, Anand N. Iyer, Deepak Kumar, Wei-Yung Hsu, Yong Sik Kim +2 more | 2004-11-02 |
| 6699115 | Polishing pad having a grooved pattern for use in a chemical mechanical polishing apparatus | Sen-Hou Ko | 2004-03-02 |
| 6645061 | Polishing pad having a grooved pattern for use in chemical mechanical polishing | Doyle E. Bennett, Fred C. Redeker, Ginetto Addiego | 2003-11-11 |
| 6616513 | Grid relief in CMP polishing pad to accurately measure pad wear, pad profile and pad wear profile | — | 2003-09-09 |
| 6572446 | Chemical mechanical polishing pad conditioning element with discrete points and compliant membrane | Manoocher Birang, Robert D. Tolles, Steven M. Zuniga, Charles C. Garretson | 2003-06-03 |
| 6561381 | Closed loop control over delivery of liquid material to semiconductor processing tool | Benjamin A. Bonner, Michael W. Richter | 2003-05-13 |
| 6520847 | Polishing pad having a grooved pattern for use in chemical mechanical polishing | Sen-Hou Ko | 2003-02-18 |
| 6435942 | Chemical mechanical polishing processes and components | Raymond R. Jin, Jeffrey Drue David, Fred C. Redeker | 2002-08-20 |
| 6361405 | Utility wafer for chemical mechanical polishing | Jeffrey Drue David, Benjamin A. Bonner, Sidney P. Huey | 2002-03-26 |
| 6319098 | Method of post CMP defect stability improvement | Peter McKeever, Chad Garretson | 2001-11-20 |
| 6273806 | Polishing pad having a grooved pattern for use in a chemical mechanical polishing apparatus | Doyle E. Bennett, Fred C. Redeker, Ginnetto Addiego | 2001-08-14 |
| 6251001 | Substrate polishing with reduced contamination | Jay D. Pinson, II, Brian J. Brown, Benjamin A. Bonner, Doyle E. Bennett, Nitin Shah +1 more | 2001-06-26 |
| 6251215 | Carrier head with a multilayer retaining ring for chemical mechanical polishing | Steven M. Zuniga, Lawrence Rosenberg | 2001-06-26 |
| 6241596 | Method and apparatus for chemical mechanical polishing using a patterned pad | Hung Chih Chen, Erik S. Rondum | 2001-06-05 |
| 6220941 | Method of post CMP defect stability improvement | Boris Fishkin, Charles C. Garretson, Peter McKeever, Gopalakrishna B. Prabhu, Doyle E. Bennett +2 more | 2001-04-24 |
| 6162368 | Technique for chemical mechanical polishing silicon | Shijian Li, Fred C. Redeker | 2000-12-19 |
| 5984769 | Polishing pad having a grooved pattern for use in a chemical mechanical polishing apparatus | Doyle E. Bennett, Fred C. Redeker, Ginetto Addiego | 1999-11-16 |