Issued Patents All Time
Showing 26–50 of 54 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6827982 | Binder-enriched silicalite adhesion layer and apparatus for fabricating the same | Justin Gaynor, Archita Sengupta | 2004-12-07 |
| 6821571 | Plasma treatment to enhance adhesion and to minimize oxidation of carbon-containing layers | — | 2004-11-23 |
| 6794311 | Method and apparatus for treating low k dielectric layers to reduce diffusion | Kegang Huang, Ping Xu | 2004-09-21 |
| 6777349 | Hermetic silicon carbide | Haiying Fu, Ka Shun Wong, Xingyuan Tang, Bart J. van Schravendijk | 2004-08-17 |
| 6734102 | Plasma treatment for copper oxide reduction | Sudha Rathi, Ping Xu | 2004-05-11 |
| 6700202 | Semiconductor device having reduced oxidation interface | Christopher Dennis Bencher, Sudha Rathi, Christopher S. Ngai, Bok Hoen Kim | 2004-03-02 |
| 6669858 | Integrated low k dielectrics and etch stops | Claes Bjorkman, Min Melissa Yu, Hongquing Shan, David Cheung, Wai-Fan Yau +7 more | 2003-12-30 |
| 6635583 | Silicon carbide deposition for use as a low-dielectric constant anti-reflective coating | Christopher Dennis Bencher, Joe Feng, Mei-Yee Shek, Chris Ngai | 2003-10-21 |
| 6562544 | Method and apparatus for improving accuracy in photolithographic processing of substrates | David Cheung, Joe Feng, Wai-Fan Yau | 2003-05-13 |
| 6541369 | Method and apparatus for reducing fixed charges in a semiconductor device | Chris Bencher, Sudha Rathi | 2003-04-01 |
| 6533855 | Dispersions of silicalite and zeolite nanoparticles in nonpolar solvents | Justin Gaynor | 2003-03-18 |
| 6517913 | Method and apparatus for reducing perfluorocompound gases from substrate processing equipment emissions | David Cheung, Sebastien Raoux, William Taylor, Mark Fodor, Kevin Fairbairn | 2003-02-11 |
| 6451686 | Control of semiconductor device isolation properties through incorporation of fluorine in peteos films | Chris Ngai, Joel Glenn, Mei-Yee Shek | 2002-09-17 |
| 6436843 | System and method for coating substrates using ink jet technology | Henner Meinhold, Fred J. Chetcuti | 2002-08-20 |
| 6395092 | Apparatus for depositing high deposition rate halogen-doped silicon oxide layer | Dian Sugiarto, David Cheung | 2002-05-28 |
| 6358573 | Mixed frequency CVD process | Sebastien Raoux, Mandar Mudholkar, William Taylor, Mark Fodor, David Silvetti +2 more | 2002-03-19 |
| 6355571 | Method and apparatus for reducing copper oxidation and contamination in a semiconductor device | Christopher Dennis Bencher, Sudha Rathi, Christopher S. Ngai, Bok Hoen Kim | 2002-03-12 |
| 6340435 | Integrated low K dielectrics and etch stops | Claes Bjorkman, Min Melissa Yu, Hongquing Shan, David Cheung, Wai-Fan Yau +7 more | 2002-01-22 |
| 6324439 | Method and apparatus for applying films using reduced deposition rates | David Cheung, Joe Feng, Madhu Deshpande, Wai-Fan Yau | 2001-11-27 |
| 6209484 | Method and apparatus for depositing an etch stop layer | Wai-Fan Yau, David Cheung, Chan-Lon Yang | 2001-04-03 |
| 6187072 | Method and apparatus for reducing perfluorocompound gases from substrate processing equipment emissions | David Cheung, Sebastien Raoux, William Taylor, Mark Fodor, Kevin Fairbairn | 2001-02-13 |
| 6156149 | In situ deposition of a dielectric oxide layer and anti-reflective coating | David Cheung, Wai-Fan Yau | 2000-12-05 |
| 6127262 | Method and apparatus for depositing an etch stop layer | Wai-Fan Yau, David Cheung, Chan-Lon Yang | 2000-10-03 |
| 6098568 | Mixed frequency CVD apparatus | Sebastien Raoux, Mandar Mudholkar, William Taylor, Mark Fodor, David Silvetti +2 more | 2000-08-08 |
| 6083852 | Method for applying films using reduced deposition rates | David Cheung, Joe Feng, Madhu Deshpande, Wai-Fan Yau | 2000-07-04 |