Issued Patents All Time
Showing 126–143 of 143 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7138305 | Method and apparatus for improving stability of a 6T CMOS SRAM cell | Suman Datta, Brian S. Doyle, Robert S. Chau, Jack T. Kavalieros, Scott A. Hareland | 2006-11-21 |
| 7109111 | Method of annealing metal layers | Zhonghui Wang | 2006-09-19 |
| 6970373 | Method and apparatus for improving stability of a 6T CMOS SRAM cell | Suman Datta, Brian S. Doyle, Robert S. Chau, Jack T. Kavalieros, Scott A. Hareland | 2005-11-29 |
| 6913680 | Method of application of electrical biasing to enhance metal deposition | Hougong Wang, Girish Dixit, Fusen Chen | 2005-07-05 |
| 6911136 | Method for regulating the electrical power applied to a substrate during an immersion process | Rajeev Bajaj, Zhonghui Wang | 2005-06-28 |
| 6693481 | Fuse circuit utilizing high voltage transistors | — | 2004-02-17 |
| 6686791 | Oxide anti-fuse structure utilizing high voltage transistors | Wenllang Chen | 2004-02-03 |
| 6610189 | Method and associated apparatus to mechanically enhance the deposition of a metal film within a feature | Hougong Wang, Girish Dixit, Fusen Chen | 2003-08-26 |
| D471548 | Mobile phone holder | — | 2003-03-11 |
| 6461435 | Showerhead with reduced contact area | Karl A. Littau, Bevan Vo, Salvador P. Umotoy, Son Trinh, Chien-Teh Kao +4 more | 2002-10-08 |
| 6410089 | Chemical vapor deposition of copper using profiled distribution of showerhead apertures | Xin Sheng Guo, Keith Kuang-Kuo Koai, Ling Chen, Mohan K. Bhan | 2002-06-25 |
| 6355106 | Deposition of copper with increased adhesion | Ling Chen, Alfred Mak, Mei Chang | 2002-03-12 |
| 6319728 | Method for treating a deposited film for resistivity reduction | Mohan K. Bhan, Ling Chen, Justin Jones, Seshadri Ganguli, Timothy E. Levine +2 more | 2001-11-20 |
| 6179925 | Method and apparatus for improved control of process and purge material in substrate processing system | John V. Schmitt, Mei Chang, Stephen Voss | 2001-01-30 |
| 6171661 | Deposition of copper with increased adhesion | Ling Chen, Alfred Mak, Mei Chang | 2001-01-09 |
| 6110530 | CVD method of depositing copper films by using improved organocopper precursor blend | Ling Chen, Seshadri Ganguli, Samuel Wilson, Christophe Marcadal | 2000-08-29 |
| 6050506 | Pattern of apertures in a showerhead for chemical vapor deposition | Xin Sheng Guo, Keith Kuang-Kuo Koai, Ling Chen, Mohan K. Bhan | 2000-04-18 |
| 5376409 | Process and apparatus for the use of solid precursor sources in liquid form for vapor deposition of materials | Alain E. Kaloyeros, Eric Eisenbraun | 1994-12-27 |