Issued Patents All Time
Showing 126–150 of 383 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9165832 | Method of die singulation using laser ablation and induction of internal defects with a laser | James S. Papanu, Wei-Sheng Lei, Jungrae Park, Alexander Lerner, Brad Eaton | 2015-10-20 |
| 9164755 | Personal and pooled virtual machine update | Robert K. Leitman, Kashif Mehmood, Amjad Hussain, Ido Ben-Shachar, Sriram Sampath | 2015-10-20 |
| 9159624 | Vacuum lamination of polymeric dry films for wafer dicing using hybrid laser scribing and plasma etch approach | Wei-Sheng Lei, Prabhat Kumar, James S. Papanu, Brad Eaton | 2015-10-13 |
| 9159621 | Dicing tape protection for wafer dicing using laser scribe process | Wei-Sheng Lei, Brad Eaton | 2015-10-13 |
| 9159574 | Method of silicon etch for trench sidewall smoothing | Keven Yu | 2015-10-13 |
| 9142459 | Wafer dicing using hybrid laser scribing and plasma etch approach with mask application by vacuum lamination | Prabhat Kumar, Wei-Sheng Lei, Brad Eaton | 2015-09-22 |
| 9130057 | Hybrid dicing process using a blade and laser | Prabhat Kumar, Wei-Sheng Lei, James S. Papanu, Brad Eaton | 2015-09-08 |
| 9130056 | Bi-layer wafer-level underfill mask for wafer dicing and approaches for performing wafer dicing | James M. Holden, James S. Papanu, Wei-Sheng Lei, Brad Eaton | 2015-09-08 |
| 9130030 | Baking tool for improved wafer coating process | Jungrae Park, Wei-Sheng Lei, James S. Papanu, Brad Eaton | 2015-09-08 |
| 9129904 | Wafer dicing using pulse train laser with multiple-pulse bursts and plasma etch | Wei-Sheng Lei, Saravjeet Singh, Madhava Rao Yalamanchili, Brad Eaton | 2015-09-08 |
| 9126285 | Laser and plasma etch wafer dicing using physically-removable mask | Wei-Sheng Lei, Saravjeet Singh, Madhava Rao Yalamanchili, Brad Eaton | 2015-09-08 |
| 9112050 | Dicing tape thermal management by wafer frame support ring cooling during plasma dicing | Wei-Sheng Lei, Prabhat Kumar, Brad Eaton | 2015-08-18 |
| 9106555 | Troubleshooting routing topology based on a reference topology | Navneet Agarwal, Jean-Philippe Vasseur | 2015-08-11 |
| 9105710 | Wafer dicing method for improving die packaging quality | Wei-Sheng Lei, Brad Eaton, Aparna Iyer, Madhava Rao Yalamanchili, Jungrae Park | 2015-08-11 |
| 9093518 | Singulation of wafers having wafer-level underfill | Wei-Sheng Lei, James S. Papanu, Brad Eaton | 2015-07-28 |
| 9076860 | Residue removal from singulated die sidewall | Wei-Sheng Lei, Prabhat Kumar, James S. Papanu, Brad Eaton | 2015-07-07 |
| 9070633 | Method and apparatus for high efficiency gas dissociation in inductive coupled plasma reactor | Roy C. Nangoy, Saravjeet Singh, Jon C. Farr, Sharma Pamarthy | 2015-06-30 |
| 9065476 | Two adjacent bit values switching current source between three paths | Rahmi Hezar, Baher Haroun, Halil Kiper, Mounir Fares | 2015-06-23 |
| 9054176 | Multi-step and asymmetrically shaped laser beam scribing | Wei-Sheng Lei, Brad Eaton, Madhava Rao Yalamanchili, Saravjeet Singh, James M. Holden | 2015-06-09 |
| 9048309 | Uniform masking for wafer dicing using laser and plasma etch | Mohammad Kamruzzaman Chowdhury, Wei-Sheng Lei, Todd Egan, Brad Eaton, Madhava Rao Yalamanchili | 2015-06-02 |
| 9039910 | Methods and apparatus for controlling photoresist line width roughness | Banqiu Wu | 2015-05-26 |
| 9041198 | Maskless hybrid laser scribing and plasma etching wafer dicing process | Wei-Sheng Lei, Brad Eaton, James S. Papanu | 2015-05-26 |
| 9023227 | Increased deposition efficiency and higher chamber conductance with source power increase in an inductively coupled plasma (ICP) chamber | Jivko Dinev, Saravjeet Singh, Khalid Mohiuddin Sirajuddin, Tong Liu, Puneet Bajaj +3 more | 2015-05-05 |
| 9018079 | Wafer dicing using hybrid laser scribing and plasma etch approach with intermediate reactive post mask-opening clean | Wei-Sheng Lei, Brad Eaton, Madhava Rao Yalamanchili | 2015-04-28 |
| 9012305 | Wafer dicing using hybrid laser scribing and plasma etch approach with intermediate non-reactive post mask-opening clean | Wei-Sheng Lei, Jungrae Park, James S. Papanu, Brad Eaton | 2015-04-21 |