Issued Patents All Time
Showing 101–125 of 383 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9312177 | Screen print mask for laser scribe and plasma etch wafer dicing process | Prabhat Kumar, Brad Eaton, Wei-Sheng Lei, James S. Papanu | 2016-04-12 |
| 9299614 | Method and carrier for dicing a wafer | James M. Holden, Brad Eaton, Aparna Iyer | 2016-03-29 |
| 9299611 | Method of wafer dicing using hybrid laser scribing and plasma etch approach with mask plasma treatment for improved mask etch resistance | Wei-Sheng Lei, Brad Eaton, James S. Papanu, Jungrae Park | 2016-03-29 |
| 9287093 | Dynamic ion radical sieve and ion radical aperture for an inductively coupled plasma (ICP) reactor | Saravjeet Singh, Graeme Scott | 2016-03-15 |
| 9281244 | Hybrid wafer dicing approach using an adaptive optics-controlled laser scribing process and plasma etch process | Jungrae Park, Wei-Sheng Lei, James S. Papanu, Brad Eaton | 2016-03-08 |
| 9280051 | Methods for reducing line width roughness and/or critical dimension nonuniformity in a patterned photoresist layer | Banqiu Wu, Rao Yalamanchili, Omkaram Nalamasu | 2016-03-08 |
| 9275902 | Dicing processes for thin wafers with bumps on wafer backside | Wei-Sheng Lei, James S. Papanu, Aparna Iyer, Brad Eaton | 2016-03-01 |
| 9269604 | Wafer edge warp suppression for thin wafer supported by tape frame | Wei-Sheng Lei, Brad Eaton | 2016-02-23 |
| 9263308 | Water soluble mask for substrate dicing by laser and plasma etch | Wei-Sheng Lei, Saravjeet Singh, Madhava Rao Yalamanchili, Brad Eaton | 2016-02-16 |
| 9252057 | Laser and plasma etch wafer dicing with partial pre-curing of UV release dicing tape for film frame wafer application | Mohammad Kamruzzaman Chowdhury, Wei-Sheng Lei, Todd Egan, Brad Eaton, Madhava Rao Yalamanchili | 2016-02-02 |
| 9250514 | Apparatus and methods for fabricating a photomask substrate for EUV applications | Banqiu Wu | 2016-02-02 |
| 9245803 | Hybrid wafer dicing approach using a bessel beam shaper laser scribing process and plasma etch process | Jungrae Park, Wei-Sheng Lei, James S. Papanu, Brad Eaton | 2016-01-26 |
| 9245802 | Wafer dicing using femtosecond-based laser and plasma etch | Wei-Sheng Lei, Brad Eaton, Madhava Rao Yalamanchili, Saravjeet Singh, James M. Holden | 2016-01-26 |
| 9236305 | Wafer dicing with etch chamber shield ring for film frame wafer applications | Wei-Sheng Lei, Saravjeet Singh, Jivko Dinev, Aparna Iyer, Brad Eaton | 2016-01-12 |
| 9224625 | Laser and plasma etch wafer dicing using water-soluble die attach film | Wei-Sheng Lei, Madhava Rao Yalamanchili, Brad Eaton, Saravjeet Singh | 2015-12-29 |
| 9224650 | Wafer dicing from wafer backside and front side | Wei-Sheng Lei, Brad Eaton | 2015-12-29 |
| 9218992 | Hybrid laser and plasma etch wafer dicing using substrate carrier | Saravjeet Singh, Brad Eaton, Wei-Sheng Lei, James M. Holden, Madhava Rao Yalamanchili +1 more | 2015-12-22 |
| 9218944 | Mask etch plasma reactor having an array of optical sensors viewing the workpiece backside and a tunable element controlled in response to the optical sensors | Madhavi R. Chandrachood, Michael N. Grimbergen, Khiem K. Nguyen, Richard Lewington, Ibrahim M. Ibrahim +1 more | 2015-12-22 |
| 9209084 | Maskless hybrid laser scribing and plasma etching wafer dicing process | Wei-Sheng Lei, Brad Eaton, James S. Papanu | 2015-12-08 |
| 9202469 | Capturing noteworthy portions of audio recordings | Yogesh Moorjani, Ryan W. Kasper, Ashish V. Thapliyal, Abhinav Kuruvadi Ramesh Babu, Elizabeth Thapliyal +2 more | 2015-12-01 |
| 9196536 | Hybrid wafer dicing approach using a phase modulated laser beam profile laser scribing process and plasma etch process | Jungrae Park, Wei-Sheng Lei, James S. Papanu, Brad Eaton | 2015-11-24 |
| 9197238 | Adaptive clocking for analog-to-digital conversion | Krishnaswamy Nagaraj, Joonsung Park | 2015-11-24 |
| 9177824 | Photoresist treatment method by low bombardment plasma | Banqiu Wu, Leonid Dorf, Shahid Rauf, Kartik Ramaswamy, Omkaram Nalamasu | 2015-11-03 |
| 9177861 | Hybrid wafer dicing approach using laser scribing process based on an elliptical laser beam profile or a spatio-temporal controlled laser beam profile | Jungrae Park, Wei-Sheng Lei, James S. Papanu, Brad Eaton | 2015-11-03 |
| 9177864 | Method of coating water soluble mask for laser scribing and plasma etch | Wei-Sheng Lei, Brad Eaton, Aparna Iyer, Todd Egan, Madhava Rao Yalamanchili | 2015-11-03 |