Issued Patents All Time
Showing 151–175 of 383 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8999816 | Pre-patterned dry laminate mask for wafer dicing processes | James M. Holden, Aparna Iyer, Brad Eaton | 2015-04-07 |
| 8994911 | Optical memory device based on DHFLC material and method of preparing the same | Prakash Jai, Amit Choudhary, Anu Malik, Indrani Coondoo, Ashok Biradar | 2015-03-31 |
| 8993414 | Laser scribing and plasma etch for high die break strength and clean sidewall | Brad Eaton, Saravjeet Singh, Wei-Sheng Lei, Madhava Rao Yalamanchili, Tong Liu | 2015-03-31 |
| 8991329 | Wafer coating | Jungrae Park, Wei-Sheng Lei, Prabhat Kumar, James S. Papanu, Brad Eaton | 2015-03-31 |
| 8981973 | Successive-approximation-register (SAR) analog-to-digital converter (ADC) attenuation capacitor calibration method and apparatus | — | 2015-03-17 |
| 8980727 | Substrate patterning using hybrid laser scribing and plasma etching processing schemes | Wei-Sheng Lei, Brad Eaton | 2015-03-17 |
| 8980726 | Substrate dicing by laser ablation and plasma etch damage removal for ultra-thin wafers | Wei-Sheng Lei, Aparna Iyer, Brad Eaton, Madhava Rao Yalamanchili | 2015-03-17 |
| 8975163 | Laser-dominated laser scribing and plasma etch hybrid wafer dicing | Wei-Sheng Lei, James S. Papanu, Brad Eaton | 2015-03-10 |
| 8975162 | Wafer dicing from wafer backside | Wei-Sheng Lei, Brad Eaton, Aparna Iyer, Saravjeet Singh, Madhava Rao Yalamanchili | 2015-03-10 |
| 8969177 | Laser and plasma etch wafer dicing with a double sided UV-curable adhesive film | Mohammad Kamruzzaman Chowdhury, Wei-Sheng Lei, Todd Egan, Brad Eaton, Madhava Rao Yalamanchili | 2015-03-03 |
| 8962224 | Methods for controlling defects for extreme ultraviolet lithography (EUVL) photomask substrate | Banqiu Wu, Omkaram Nalamasu | 2015-02-24 |
| 8953854 | Contactless 3D biometric feature identification system and method thereof | Cyril Kwong | 2015-02-10 |
| 8951819 | Wafer dicing using hybrid split-beam laser scribing process with plasma etch | Wei-Sheng Lei, Brad Eaton, Madhava Rao Yalamanchili, Saravjeet Singh, Aparna Iyer | 2015-02-10 |
| 8946057 | Laser and plasma etch wafer dicing using UV-curable adhesive film | Wei-Sheng Lei, Mohammad Kamruzzaman Chowdhury, Todd Egan, Brad Eaton, Madhava Rao Yalamanchili | 2015-02-03 |
| 8940619 | Method of diced wafer transportation | Wei-Sheng Lei, Brad Eaton, Aparna Iyer, Saravjeet Singh, Todd Egan +1 more | 2015-01-27 |
| 8932939 | Water soluble mask formation by dry film lamination | Wei-Sheng Lei, James S. Papanu, Brad Eaton | 2015-01-13 |
| 8932802 | Atomic layer deposition lithography | Banqiu Wu, Omkaram Nalamasu | 2015-01-13 |
| 8927393 | Water soluble mask formation by dry film vacuum lamination for laser and plasma dicing | Wei-Sheng Lei, James S. Papanu, Prabhat Kumar, Brad Eaton | 2015-01-06 |
| 8912075 | Wafer edge warp supression for thin wafer supported by tape frame | Wei-Sheng Lei, Brad Eaton | 2014-12-16 |
| 8912077 | Hybrid laser and plasma etch wafer dicing using substrate carrier | Saravjeet Singh, Brad Eaton, Wei-Sheng Lei, James M. Holden, Madhava Rao Yalamanchili +1 more | 2014-12-16 |
| 8912078 | Dicing wafers having solder bumps on wafer backside | Wei-Sheng Lei, James S. Papanu, Aparna Iyer, Brad Eaton | 2014-12-16 |
| 8883614 | Wafer dicing with wide kerf by laser scribing and plasma etching hybrid approach | Wei-Sheng Lei, Brad Eaton, Apama Iyer, Madhava Rao Yalamanchili | 2014-11-11 |
| 8883615 | Approaches for cleaning a wafer during hybrid laser scribing and plasma etching wafer dicing processes | James M. Holden, Wei-Sheng Lei, James S. Papanu | 2014-11-11 |
| 8872909 | Method and apparatus for personal identification using finger imaging | Yingbo Zhou | 2014-10-28 |
| 8859397 | Method of coating water soluble mask for laser scribing and plasma etch | Wei-Sheng Lei, Brad Eaton, Aparna Iyer, Todd Egan, Madhava Rao Yalamanchili | 2014-10-14 |