RD

Robert Dawson

AM AMD: 130 patents #16 of 9,279Top 1%
FL Falconbridge Limited: 1 patents #13 of 44Top 30%
SL Spansion Llc.: 1 patents #435 of 769Top 60%
HO Honeywell: 1 patents #7,507 of 14,447Top 55%
📍 Gilbert, AZ: #3 of 1,739 inventorsTop 1%
🗺 Arizona: #72 of 32,909 inventorsTop 1%
Overall (All Time): #7,789 of 4,157,543Top 1%
135
Patents All Time

Issued Patents All Time

Showing 76–100 of 135 patents

Patent #TitleCo-InventorsDate
5930634 Method of making an IGFET with a multilevel gate Frederick N. Hause, H. Jim Fulford, Mark I. Gardner, Mark W. Michael, Bradley T. Moore +1 more 1999-07-27
5930642 Transistor with buried insulative layer beneath the channel region Bradley T. Moore, H. Jim Fulford, Mark I. Gardner, Frederick N. Hause, Mark W. Michael +1 more 1999-07-27
5926713 Method for achieving global planarization by forming minimum mesas in large field areas Fred N. Hause, Basab Bandyopadhyay, H. Jim Fulford, Mark W. Michael, William S. Brennan 1999-07-20
5926717 Method of making an integrated circuit with oxidizable trench liner Mark W. Michael, Basab Bandyopadhyay, H. Jim Fulford, Fred N. Hause, William S. Brennan 1999-07-20
5923982 Method of making asymmetrical transistor with lightly and heavily doped drain regions and ultra-heavily doped source region using two source/drain implant steps Daniel Kadosh, Mark I. Gardner 1999-07-13
5924008 Integrated circuit having local interconnect for reducing signal cross coupled noise Mark W. Michael, Basab Bandyopadhyay, H. Jim Fulford, Fred N. Hause, William S. Brennan 1999-07-13
5918129 Method of channel doping using diffusion from implanted polysilicon H. Jim Fulford, Mark I. Gardner, Frederick N. Hause, Mark W. Michael, Bradley T. Moore +1 more 1999-06-29
5918126 Method of fabricating an integrated circuit having devices arranged with different device densities using a bias differential to form devices with a uniform size H. Jim Fulford, Mark I. Gardner, Frederick N. Hause, Mark W. Michael, Bradley T. Moore +1 more 1999-06-29
5913106 Method for testing junction leakage of salicided devices fabricated using shallow trench and refill techniques Frederick N. Hause, Charles E. May 1999-06-15
5907764 In-line detection and assessment of net charge in PECVD silicon dioxide (oxide) layers John K. Lowell, Fred N. Hause 1999-05-25
5904539 Semiconductor trench isolation process resulting in a silicon mesa having enhanced mechanical and electrical properties Fred N. Hause, Charles E. May, Mark I. Gardner, Kuang-Yeh Chang 1999-05-18
5899732 Method of implanting silicon through a polysilicon gate for punchthrough control of a semiconductor device Mark I. Gardner, Derick J. Wristers, H. Jim Fulford, Frederick N. Hause, Mark W. Michael +1 more 1999-05-04
5899727 Method of making a semiconductor isolation region bounded by a trench and covered with an oxide to improve planarization Fred N. Hause, Basab Bandyopadhyay, H. Jim Fulford, Mark W. Michael, William S. Brennan 1999-05-04
5894168 Mask generation technique for producing an integrated circuit with optimal polysilicon interconnect layout for achieving global planarization Mark W. Michael, Fred N. Hause, Basab Bandyopadhyay, H. Jim Fulford, William S. Brennan 1999-04-13
5888675 Reticle that compensates for radiation-induced lens error in a photolithographic system Bradley T. Moore, H. Jim Fulford, Mark I. Gardner, Frederick N. Hause, Mark W. Michael +1 more 1999-03-30
5885887 Method of making an igfet with selectively doped multilevel polysilicon gate Frederick N. Hause, H. Jim Fulford Jr., Mark I. Gardner, Mark W. Michael, Bradley T. Moore +1 more 1999-03-23
5885877 Composite gate electrode incorporating dopant diffusion-retarding barrier layer adjacent to underlying gate dielectric Mark I. Gardner, H. Jim Fulford, Frederick N. Hause, Daniel Kadosh, Mark W. Michael +2 more 1999-03-23
5877058 Method of forming an insulated-gate field-effect transistor with metal spacers Mark I. Gardner, H. Jim Fulford, Frederick N. Hause, Mark W. Michael, Bradley T. Moore +1 more 1999-03-02
5874346 Subtrench conductor formation with large tilt angle implant H. Jim Fulford Jr. 1999-02-23
5866945 Borderless vias with HSQ gap filled patterned metal layers Robert Chen, Jeffrey A. Shields, Khanh Tran 1999-02-02
5854515 Integrated circuit having conductors of enhanced cross-sectional area Basab Bandyopadhyay, H. Jim Fulford, Fred N. Hause, Mark W. Michael, William S. Brennan 1998-12-29
5854131 Integrated circuit having horizontally and vertically offset interconnect lines Mark W. Michael, Basab Bandyopadhyay, H. Jim Fulford Jr., Fred N. Hause, William S. Brennan 1998-12-29
5851913 Method for forming a multilevel interconnect structure of an integrated circuit by a single via etch and single fill process William S. Brennan, H. Jim Fulford, Fred N. Hause, Basab Bandyopadhyay, Mark W. Michael 1998-12-22
5851891 IGFET method of forming with silicide contact on ultra-thin gate H. Jim Fulford, Mark I. Gardner, Frederick N. Hause, Mark W. Michael, Bradley T. Moore +1 more 1998-12-22
5851889 Semiconductor gate conductor with a substantially uniform doping profile having minimal susceptibility to dopant penetration into the underlying gate dielectric Mark W. Michael 1998-12-22