Issued Patents 2024
Showing 26–50 of 57 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12057438 | Die stack structure and manufacturing method thereof | Chen-Hua Yu, Ming-Fa Chen, Sung-Feng Yeh, Tzuan-Horng Liu | 2024-08-06 |
| 12046579 | Package having bonding layers | Ming-Fa Chen, Chao-Wen Shih, Sung-Feng Yeh, Tzuan-Horng Liu | 2024-07-23 |
| 12046480 | Manufacturing method of a semiconductor device | Shou-Zen Chang, Chun-Lin Lu, Kai-Chiang Wu, Ching-Feng Yang, Vincent Chen +3 more | 2024-07-23 |
| 12021064 | Semiconductor devices and methods of manufacture | Shin-Puu Jeng | 2024-06-25 |
| 12020953 | Fan-out structure and method of fabricating the same | Chen-Hua Yu, An-Jhih Su, Chi-Hsi Wu, Der-Chyang Yeh, Wei-Yu Chen | 2024-06-25 |
| 12020997 | Methods of forming semiconductor device packages having alignment marks on a carrier substrate | Chen-Hua Yu, Sung-Feng Yeh, Ming-Fa Chen, Hui Liu, Ching-Pin Yuan | 2024-06-25 |
| 12021051 | Semiconductor package and method of forming the same | An-Jhih Su | 2024-06-25 |
| 12021057 | Semiconductor structure and semiconductor die | Ming-Fa Chen | 2024-06-25 |
| 12009316 | Semiconductor structure and method of manufacturing a semiconductor structure | Hsien-Wen Liu, Jie Chen | 2024-06-11 |
| 12009386 | Structure and method for forming integrated high density MIM capacitor | Ying-Ju Chen, Jie Chen, Ming-Fa Chen | 2024-06-11 |
| 12009335 | Structure and method of forming a joint assembly | Ying-Ju Chen, An-Jhih Su, Der-Chyang Yeh, Chi-Hsi Wu, Chen-Hua Yu | 2024-06-11 |
| 12002778 | Semiconductor packages and methods of forming the same | Ming-Fa Chen, Sung-Feng Yeh, Jie Chen | 2024-06-04 |
| 11996401 | Packaged die and RDL with bonding structures therebetween | Jie Chen | 2024-05-28 |
| 11984405 | Pad structure design in fan-out package | Chen-Hua Yu, Shin-Puu Jeng, Der-Chyang Yeh | 2024-05-14 |
| 11978716 | Package | Sung-Feng Yeh, Ming-Fa Chen | 2024-05-07 |
| 11973170 | Semiconductor package and manufacturing method of semiconductor package | Ming-Fa Chen, Jie Chen | 2024-04-30 |
| 11967563 | Fan-out package having a main die and a dummy die | Yan-Fu Lin, Chen-Hua Yu, Meng-Tsan Lee, Wei-Cheng Wu | 2024-04-23 |
| 11960127 | Semiconductor package and manufacturing method thereof | Jie Chen, Ming-Fa Chen | 2024-04-16 |
| 11955433 | Package-on-package device | Ming-Fa Chen, Sung-Feng Yeh | 2024-04-09 |
| 11942454 | Package and manufacturing method thereof | Jie Chen, Ming-Fa Chen | 2024-03-26 |
| 11942436 | Passivation scheme design for wafer singulation | Ying-Ju Chen, Ming-Fa Chen | 2024-03-26 |
| 11935802 | Integrated circuit package and method of forming same | Ming-Fa Chen, Chen-Hua Yu | 2024-03-19 |
| 11929322 | Method of forming device and package structure | An-Jhih Su, Li-Hsien Huang | 2024-03-12 |
| 11908817 | Bonding structure of dies with dangling bonds | Ming-Fa Chen, Chih-Chia Hu | 2024-02-20 |
| 11908836 | Semiconductor package and method of manufacturing semiconductor package | Ming-Fa Chen | 2024-02-20 |