Issued Patents 2024
Showing 51–57 of 57 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11908692 | Method for fabricating a chip package | Jie Chen, Tzuan-Horng Liu, Ying-Ju Chen | 2024-02-20 |
| 11899242 | Method of manufacturing a packaged device with optical pathway | Ming-Fa Chen | 2024-02-13 |
| 11869819 | Integrated circuit component and package structure having the same | Tzuan-Horng Liu, Chao-Hsiang Yang, Ming-Fa Chen | 2024-01-09 |
| 11862599 | Bonding to alignment marks with dummy alignment marks | Ying-Ju Chen, Ming-Fa Chen | 2024-01-02 |
| 11862606 | Packages with metal line crack prevention design | Chen-Hua Yu, Shin-Puu Jeng, Der-Chyang Yeh, Jie Chen | 2024-01-02 |
| 11862605 | Integrated circuit package and method of forming same | Ming-Fa Chen, Chen-Hua Yu | 2024-01-02 |
| 11862590 | Integrated circuit package and method of forming thereof | Ming-Fa Chen, Ying-Ju Chen | 2024-01-02 |