Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11869819 | Integrated circuit component and package structure having the same | Tzuan-Horng Liu, Hsien-Wei Chen, Ming-Fa Chen | 2024-01-09 |
CY
Chao-Hsiang Yang
Overall (2024): #504,097 of 561,600Top 90%
1
Patents 2024