Issued Patents 2023
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11824013 | Package substrate with reduced interconnect stress | Lauren A. Link, Andrew J. Brown, Sandeep B. Sane | 2023-11-21 |
| 11676891 | Method to enable 30 microns pitch EMIB or below | Hongxia Feng, Dingying Xu, Matthew Tingey, Meizi Jiao, Chung Kwang Christopher Tan | 2023-06-13 |
| 11651885 | Magnetic core inductors | Junnan Zhao, Ying Wang, Cheng Xu, Kyu Oh Lee, Yikang Deng | 2023-05-16 |
| 11622448 | Sandwich-molded cores for high-inductance architectures | Brandon C. Marin, Tarek A. Ibrahim, Srinivas V. Pietambaram, Andrew J. Brown, Gang Duan +1 more | 2023-04-04 |
| 11610706 | Release layer-assisted selective embedding of magnetic material in cored and coreless organic substrates | Sai Vadlamani, Prithwish Chatterjee, Rahul Jain, Kyu Oh Lee, Andrew J. Brown +1 more | 2023-03-21 |
| 11581271 | Methods to pattern TFC and incorporation in the ODI architecture and in any build up layer of organic substrate | Rahul Jain, Kyu Oh Lee, Islam A. Salama, Amruthavalli Pallavi Alur, Wei-Lun Kane Jen +1 more | 2023-02-14 |