Issued Patents 2023
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11830788 | Integrated circuits and methods for forming integrated circuits | Carl Naylor, Ashish Agrawal, Urusa Alaan, Mauro J. Kobrinsky, Kevin Lin +1 more | 2023-11-28 |
| 11830768 | Integrated circuits with line breaks and line bridges within a single interconnect level | Kevin Lin | 2023-11-28 |
| 11749560 | Cladded metal interconnects | Thomas Marieb, Zhiyong Ma, Miriam Reshotko, Flavio Griggio, Rahim Kasim +1 more | 2023-09-05 |
| 11742346 | Interconnect techniques for electrically connecting source/drain regions of stacked transistors | Aaron D. Lilak, Gilbert Dewey, Cheng-Ying Huang, Ehren Mannebach, Rishabh Mehandru +4 more | 2023-08-29 |
| 11670588 | Selectable vias for back end of line interconnects | Ashish Agrawal, Kevin Lin, Abhishek A. Sharma, Carl Naylor, Urusa Alaan | 2023-06-06 |
| 11664305 | Staggered lines for interconnect performance improvement and processes for forming such | Kevin Lin, Manish Chandhok, Miriam Reshotko, Eungnak Han, Gurpreet Singh +2 more | 2023-05-30 |
| 11652067 | Methods of forming substrate interconnect structures for enhanced thin seed conduction | Radek P. Chalupa, Flavio Griggio, Inane Meric, Jiun-Chan Yang | 2023-05-16 |
| 11637185 | Contact stacks to reduce hydrogen in semiconductor devices | Justin R. Weber, Harold W. Kennel, Abhishek A. Sharma, Matthew V. Metz, Tahir Ghani +4 more | 2023-04-25 |
| 11626451 | Magnetic memory device with ruthenium diffusion barrier | Emily Walker, Carl Naylor, Kaan Oguz, Kevin Lin, Tanay Gosavi +6 more | 2023-04-11 |
| 11557536 | Integrated circuits (IC's) with electro-migration (EM)—resistant segments in an interconnect level | Kevin Lin, Manish Chandhok | 2023-01-17 |