| 11830788 |
Integrated circuits and methods for forming integrated circuits |
Carl Naylor, Ashish Agrawal, Urusa Alaan, Mauro J. Kobrinsky, Kevin Lin +1 more |
2023-11-28 |
| 11830768 |
Integrated circuits with line breaks and line bridges within a single interconnect level |
Kevin Lin |
2023-11-28 |
| 11749560 |
Cladded metal interconnects |
Thomas Marieb, Zhiyong Ma, Miriam Reshotko, Flavio Griggio, Rahim Kasim +1 more |
2023-09-05 |
| 11742346 |
Interconnect techniques for electrically connecting source/drain regions of stacked transistors |
Aaron D. Lilak, Gilbert Dewey, Cheng-Ying Huang, Ehren Mannebach, Rishabh Mehandru +4 more |
2023-08-29 |
| 11670588 |
Selectable vias for back end of line interconnects |
Ashish Agrawal, Kevin Lin, Abhishek A. Sharma, Carl Naylor, Urusa Alaan |
2023-06-06 |
| 11664305 |
Staggered lines for interconnect performance improvement and processes for forming such |
Kevin Lin, Manish Chandhok, Miriam Reshotko, Eungnak Han, Gurpreet Singh +2 more |
2023-05-30 |
| 11652067 |
Methods of forming substrate interconnect structures for enhanced thin seed conduction |
Radek P. Chalupa, Flavio Griggio, Inane Meric, Jiun-Chan Yang |
2023-05-16 |
| 11637185 |
Contact stacks to reduce hydrogen in semiconductor devices |
Justin R. Weber, Harold W. Kennel, Abhishek A. Sharma, Matthew V. Metz, Tahir Ghani +4 more |
2023-04-25 |
| 11626451 |
Magnetic memory device with ruthenium diffusion barrier |
Emily Walker, Carl Naylor, Kaan Oguz, Kevin Lin, Tanay Gosavi +6 more |
2023-04-11 |
| 11557536 |
Integrated circuits (IC's) with electro-migration (EM)—resistant segments in an interconnect level |
Kevin Lin, Manish Chandhok |
2023-01-17 |