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Advanced lithography and self-assembled devices |
Richard E. Schenker, Robert L. Bristol, Kevin Lin, Florian Gstrein, James M. Blackwell +6 more |
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| 11837542 |
Interconnects having a portion without a liner material and related structures, devices, and methods |
Richard E. Schenker, Tristan A. Tronic |
2023-12-05 |
| 11837644 |
Contact over active gate structures with metal oxide-caped contacts to inhibit shorting |
Rami Hourani, Richard Vreeland, Giselle Elbaz, Richard E. Schenker, Gurpreet Singh +4 more |
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| 11791375 |
Capacitor architectures in semiconductor devices |
Sudipto Naskar, Abhishek A. Sharma, Roman Caudillo, Scott B. Clendenning, Cheyun Lin |
2023-10-17 |
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Staggered lines for interconnect performance improvement and processes for forming such |
Kevin Lin, Miriam Reshotko, Christopher J. Jezewski, Eungnak Han, Gurpreet Singh +2 more |
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Integrated circuits (IC's) with electro-migration (EM)—resistant segments in an interconnect level |
Kevin Lin, Christopher J. Jezewski |
2023-01-17 |