Issued Patents 2023
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11843054 | Vertical architecture of thin film transistors | Van H. Le, Seung Hoon Sung, Benjamin Chu-Kung, Matthew V. Metz, Yih Wang +6 more | 2023-12-12 |
| 11749560 | Cladded metal interconnects | Thomas Marieb, Zhiyong Ma, Christopher J. Jezewski, Flavio Griggio, Rahim Kasim +1 more | 2023-09-05 |
| 11664305 | Staggered lines for interconnect performance improvement and processes for forming such | Kevin Lin, Manish Chandhok, Christopher J. Jezewski, Eungnak Han, Gurpreet Singh +2 more | 2023-05-30 |
| 11646266 | Helmet structures for semiconductor interconnects | Kevin Lin, Nafees Kabir | 2023-05-09 |
| 11610810 | Maskless air gap enabled by a single damascene process | Richard E. Schenker, Nafees Kabir | 2023-03-21 |