Issued Patents 2023
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11849639 | Forming semiconductor-superconductor hybrid devices with a horizontally-confined channel | Geoffrey Charles Gardner, Sergei V. Gronin, Raymond Leonard Kallaher, Noah Seth Clay, Michael James Manfra | 2023-12-19 |
| 11749560 | Cladded metal interconnects | Thomas Marieb, Zhiyong Ma, Miriam Reshotko, Christopher J. Jezewski, Rahim Kasim +1 more | 2023-09-05 |
| 11652067 | Methods of forming substrate interconnect structures for enhanced thin seed conduction | Christopher J. Jezewski, Radek P. Chalupa, Inane Meric, Jiun-Chan Yang | 2023-05-16 |