Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11652067 | Methods of forming substrate interconnect structures for enhanced thin seed conduction | Christopher J. Jezewski, Radek P. Chalupa, Flavio Griggio, Jiun-Chan Yang | 2023-05-16 |