| 11854787 |
Advanced lithography and self-assembled devices |
Richard E. Schenker, Robert L. Bristol, Florian Gstrein, James M. Blackwell, Marie Krysak +6 more |
2023-12-26 |
| 11854882 |
Subtractive plug and tab patterning with photobuckets for back end of line (BEOL) spacer-based interconnects |
Robert L. Bristol, Richard E. Schenker |
2023-12-26 |
| 11830788 |
Integrated circuits and methods for forming integrated circuits |
Carl Naylor, Ashish Agrawal, Urusa Alaan, Christopher J. Jezewski, Mauro J. Kobrinsky +1 more |
2023-11-28 |
| 11830768 |
Integrated circuits with line breaks and line bridges within a single interconnect level |
Christopher J. Jezewski |
2023-11-28 |
| 11798838 |
Capacitance reduction for semiconductor devices based on wafer bonding |
Ehren Mannebach, Aaron D. Lilak, Rishabh Mehandru, Hui Jae Yoo, Patrick Morrow |
2023-10-24 |
| 11784121 |
Integrated circuit components with dummy structures |
Nicholas James Harold McKubre, Richard Vreeland, Sansaptak Dasgupta |
2023-10-10 |
| 11769814 |
Device including air gapping of gate spacers and other dielectrics and process for providing such |
Ehren Mannebach, Aaron D. Lilak, Hui Jae Yoo, Patrick Morrow, Tristan A. Tronic |
2023-09-26 |
| 11764306 |
Multi-layer crystalline back gated thin film transistor |
Van H. Le, Abhishek A. Sharma, Gilbert Dewey, Kent Millard, Jack T. Kavalieros +6 more |
2023-09-19 |
| 11715791 |
Group III-Nitride devices on SOI substrates having a compliant layer |
Marko Radosavljevic, Han Wui Then, Sansaptak Dasgupta, Paul B. Fischer |
2023-08-01 |
| 11710636 |
Metal and spacer patterning for pitch division with multiple line widths and spaces |
Charles H. Wallace |
2023-07-25 |
| 11705395 |
Core fill to reduce dishing and metal pillar fill to increase metal density of interconnects |
— |
2023-07-18 |
| 11670588 |
Selectable vias for back end of line interconnects |
Christopher J. Jezewski, Ashish Agrawal, Abhishek A. Sharma, Carl Naylor, Urusa Alaan |
2023-06-06 |
| 11664305 |
Staggered lines for interconnect performance improvement and processes for forming such |
Manish Chandhok, Miriam Reshotko, Christopher J. Jezewski, Eungnak Han, Gurpreet Singh +2 more |
2023-05-30 |
| 11664270 |
Metal-insulator-metal (MIM) structure supporting high voltage applications and low voltage applications |
— |
2023-05-30 |
| 11646266 |
Helmet structures for semiconductor interconnects |
Miriam Reshotko, Nafees Kabir |
2023-05-09 |
| 11626451 |
Magnetic memory device with ruthenium diffusion barrier |
Emily Walker, Carl Naylor, Kaan Oguz, Tanay Gosavi, Christopher J. Jezewski +6 more |
2023-04-11 |
| 11616014 |
Peripheral inductors |
Paul B. Fischer |
2023-03-28 |
| 11605592 |
Method to fabricate metal and ferromagnetic metal multilayer interconnect line for skin effect suppression |
Noriyuki Sato, Kevin P. O'Brien, Hui Jae Yoo |
2023-03-14 |
| 11594485 |
Local interconnect with air gap |
Scott B. Clendenning, Tristan A. Tronic, Urusa Alaan, Ehren Mannebach |
2023-02-28 |
| 11557536 |
Integrated circuits (IC's) with electro-migration (EM)—resistant segments in an interconnect level |
Christopher J. Jezewski, Manish Chandhok |
2023-01-17 |