| 11812599 |
Compute near memory with backend memory |
Abhishek A. Sharma, Noriyuki Sato, Sarah Atanasov, Huseyin Ekin Sumbul, Gregory K. Chen +3 more |
2023-11-07 |
| 11798838 |
Capacitance reduction for semiconductor devices based on wafer bonding |
Ehren Mannebach, Aaron D. Lilak, Rishabh Mehandru, Patrick Morrow, Kevin Lin |
2023-10-24 |
| 11769814 |
Device including air gapping of gate spacers and other dielectrics and process for providing such |
Ehren Mannebach, Aaron D. Lilak, Patrick Morrow, Kevin Lin, Tristan A. Tronic |
2023-09-26 |
| 11764263 |
Gate-all-around integrated circuit structures having depopulated channel structures using multiple bottom-up oxidation approaches |
Ehren Mannebach, Anh Phan, Aaron D. Lilak, Willy Rachmady, Gilbert Dewey +3 more |
2023-09-19 |
| 11764104 |
Forming an oxide volume within a fin |
Cheng-Ying Huang, Gilbert Dewey, Jack T. Kavalieros, Aaron D. Lilak, Ehren Mannebach +3 more |
2023-09-19 |
| 11699681 |
Multi-chip module having a stacked logic chip and memory stack |
Abhishek A. Sharma, Van H. Le, Huseyin Ekin Sumbul, Phil Knag, Gregory K. Chen +1 more |
2023-07-11 |
| 11672133 |
Vertically stacked memory elements with air gap |
Aaron D. Lilak, Patrick Morrow, Sean T. Ma, Scott B. Clendenning, Abhishek A. Sharma +2 more |
2023-06-06 |
| 11670545 |
Conformal low temperature hermetic dielectric diffusion barriers |
Sean King, Sreenivas Kosaraju, Timothy E. Glassman |
2023-06-06 |
| 11646352 |
Stacked source-drain-gate connection and process for forming such |
Ehren Mannebach, Aaron D. Lilak, Patrick Morrow, Anh Phan, Willy Rachmady +2 more |
2023-05-09 |
| 11640961 |
III-V source/drain in top NMOS transistors for low temperature stacked transistor contacts |
Gilbert Dewey, Ravi Pillarisetty, Jack T. Kavalieros, Aaron D. Lilak, Willy Rachmady +6 more |
2023-05-02 |
| 11605592 |
Method to fabricate metal and ferromagnetic metal multilayer interconnect line for skin effect suppression |
Noriyuki Sato, Kevin Lin, Kevin P. O'Brien |
2023-03-14 |
| 11605565 |
Three dimensional integrated circuits with stacked transistors |
Cheng-Ying Huang, Willy Rachmady, Gilbert Dewey, Aaron D. Lilak, Kimin Jun +5 more |
2023-03-14 |
| 11594673 |
Two terminal spin orbit memory devices and methods of fabrication |
Noriyuki Sato, Angeline Smith, Tanay Gosavi, Sasikanth Manipatruni, Kaan Oguz +8 more |
2023-02-28 |
| 11587827 |
Conformal low temperature hermetic dielectric diffusion barriers |
Sean King, Sreenivas Kosaraju, Timothy E. Glassman |
2023-02-21 |
| 11574910 |
Device with air-gaps to reduce coupling capacitance and process for forming such |
Abhishek A. Sharma, Willy Rachmady, Van H. Le, Travis W. Lajoie, Urusa Alaan +2 more |
2023-02-07 |
| 11569238 |
Vertical memory cells |
Aaron D. Lilak, Willy Rachmady, Gilbert Dewey, Kimin Jun, Patrick Morrow +5 more |
2023-01-31 |
| 11569126 |
Interconnect wires including relatively low resistivity cores |
Tejaswi K. Indukuri, Ramanan V. Chebiam, James S. Clarke |
2023-01-31 |