Issued Patents 2022
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11521914 | Microelectronic assemblies having a cooling channel | Zhimin Wan, Cheng Xu, Yikang Deng, Ying Wang, Chong Zhang +3 more | 2022-12-06 |
| 11502017 | Effective heat conduction from hotspot to heat spreader through package substrate | Cheng Xu, Zhimin Wan, Lingtao Liu, Yikang Deng, Chandra Mohan Jha +1 more | 2022-11-15 |
| 11495555 | Magnetic bilayer structure for a cored or coreless semiconductor package | Yikang Deng, Jonathan L. Rosch, Andrew J. Brown | 2022-11-08 |
| 11482471 | Thermal management solutions for integrated circuit packages | Cheng Xu, Zhimin Wan, Ying Wang, Yikang Deng, Chong Zhang +3 more | 2022-10-25 |
| 11450471 | Methods to selectively embed magnetic materials in substrate and corresponding structures | Cheng Xu, Kyu Oh Lee, Rahul Jain, Ji-Yong Park, Sai Vadlamani +1 more | 2022-09-20 |
| 11443885 | Thin film barrier seed metallization in magnetic-plugged through hole inductor | Kristof Darmawikarta, Srinivas V. Pietambaram, Sandeep Gaan, Sri Ranga Sai Boyapati, Prithwish Chatterjee +2 more | 2022-09-13 |
| 11443892 | Substrate assembly with encapsulated magnetic feature | Kyu Oh Lee, Rahul Jain, Sai Vadlamani, Cheng Xu, Ji-Yong Park +1 more | 2022-09-13 |
| 11417614 | Methods to embed magnetic material as first layer on coreless substrates and corresponding structures | Cheng Xu, Kyu Oh Lee, Rahul Jain, Ji-Yong Park, Sai Vadlamani +1 more | 2022-08-16 |
| 11387224 | Phase change material in substrate cavity | Cheng Xu, Zhimin Wan, Yikang Deng, Chong Zhang, Chandra Mohan Jha +2 more | 2022-07-12 |
| 11355459 | Embedding magnetic material, in a cored or coreless semiconductor package | Kyu Oh Lee, Sai Vadlamani, Rahul Jain, Ji-Yong Park, Cheng Xu +1 more | 2022-06-07 |
| 11335632 | Magnetic inductor structures for package devices | Prithwish Chatterjee, Sai Vadlamani, Ying Wang, Rahul Jain, Andrew J. Brown +3 more | 2022-05-17 |
| 11322290 | Techniques for an inductor at a first level interface | Cheng Xu, Yikang Deng, Kyu Oh Lee, Ji-Yong Park, Srinivas V. Pietambaram +3 more | 2022-05-03 |
| 11276634 | High density package substrate formed with dielectric bi-layer | Srinivas V. Pietambaram, Rahul N. Manepalli, David Unruh, Frank Truong, Kyu Oh Lee +1 more | 2022-03-15 |
| 11246218 | Core layer with fully encapsulated co-axial magnetic material around PTH in IC package substrate | Chong Zhang, Ying Wang, Cheng Xu, Yikang Deng | 2022-02-08 |
| 11217534 | Galvanic corrosion protection for semiconductor packages | Cheng Xu, Ji-Yong Park, Kyu Oh Lee | 2022-01-04 |