Issued Patents 2018
Showing 26–35 of 35 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9966346 | Bump structure and method of forming same | Guan-Yu Chen, Yu-Wei Lin, Yu-Jen Tseng, Tin-Hao Kuo | 2018-05-08 |
| 9953939 | Conductive contacts having varying widths and method of manufacturing same | Yen-Liang Lin, Yu-Jen Tseng, Chang-Chia Huang, Tin-Hao Kuo | 2018-04-24 |
| 9935081 | Hybrid interconnect for chip stacking | Kuo Lung Pan, Yu-Feng Chen, Mirng-Ji Lii | 2018-04-03 |
| 9935073 | Semiconductor structure and manufacturing method of the same | Yen-Liang Lin, Mirng-Ji Lii, Tin-Hao Kuo, Yu-Feng Chen, Sheng-Yu Wu | 2018-04-03 |
| 9917035 | Bump-on-trace interconnection structure for flip-chip packages | Yu-Jen Tseng, Yen-Liang Lin, Tin-Hao Kuo, Mirng-Ji Lii | 2018-03-13 |
| 9911725 | Packaging mechanisms for dies with different sizes of connectors | Chih-Hua Chen, Ching-Wen Hsiao | 2018-03-06 |
| 9905524 | Bump structures in semiconductor device and packaging assembly | Chita Chuang, Yao-Chun Chuang, Tsung-Shu Lin, Chen-Cheng Kuo | 2018-02-27 |
| 9881885 | Metal routing architecture for integrated circuits | Chen-Cheng Kuo, Chita Chuang, Chih-Hua Chen, Yao-Chun Chuang | 2018-01-30 |
| 9871013 | Contact area design for solder bonding | Pei-Chun Tsai, Yu-Feng Chen, Tin-Hao Kuo, Yu-Chih Huang, Sheng-Yu Wu | 2018-01-16 |
| 9859252 | Cooling channels in 3DIC stacks | Kai-Ming Ching, Ching-Wen Hsiao, Tsung-Ding Wang, Ming Hung Tseng | 2018-01-02 |