Issued Patents 2018
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10157789 | Via formation using sidewall image transfer process to define lateral dimension | Shyng-Tsong Chen, Cheng Chi, Chi-Chun Liu, Sylvie Mignot, Yann Mignot +3 more | 2018-12-18 |
| 10020255 | Integration of super via structure in BEOL | Ruqiang Bao, Joe Lee, Yann Mignot, Junli Wang, Yongan Xu | 2018-07-10 |
| 10020254 | Integration of super via structure in BEOL | Ruqiang Bao, Joe Lee, Yann Mignot, Junli Wang, Yongan Xu | 2018-07-10 |
| 10002831 | Selective and non-selective barrier layer wet removal | Benjamin D. Briggs, Elbert E. Huang, Raghuveer R. Patlolla, Cornelius Brown Peethala, David L. Rath | 2018-06-19 |
| 9966337 | Fully aligned via with integrated air gaps | Benjamin D. Briggs, Lawrence A. Clevenger, Huai Huang, Christopher J. Penny, Michael Rizzolo | 2018-05-08 |
| 9947622 | Ultrathin superlattice of MnO/Mn/MnN and other metal oxide/metal/metal nitride liners and caps for copper low dielectric constant interconnects | Donald F. Canaperi, Daniel C. Edelstein, Alfred Grill, Son V. Nguyen, Takeshi Nogami +1 more | 2018-04-17 |
| 9947581 | Method of forming a copper based interconnect structure | Daniel C. Edelstein, Son V. Nguyen, Takeshi Nogami, Deepika Priyadarshini | 2018-04-17 |
| 9947579 | Copper interconnect structure with manganese oxide barrier layer | Daniel C. Edelstein, Son V. Nguyen, Takeshi Nogami, Deepika Priyadarshini | 2018-04-17 |
| 9899317 | Nitridization for semiconductor structures | Lawrence A. Clevenger, Roger A. Quon, Terry A. Spooner, Wei Wang, Chi-Chao Yang | 2018-02-20 |