Issued Patents 2018
Showing 25 most recent of 35 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10150323 | Structure, system, method, and recording medium of implementing a directed self-assembled security pattern | Lawrence A. Clevenger, Bartlet H. DeProspo, Michael Rizzolo | 2018-12-11 |
| 10153202 | Neutral atom beam nitridation for copper interconnect | Lawrence A. Clevenger, Michael Rizzolo, Chih-Chao Yang | 2018-12-11 |
| 10134674 | Structure and method for improved stabilization of cobalt cap and/or cobalt liner in interconnects | James J. Kelly, Koichi Motoyama, Roger A. Quon, Michael Rizzolo, Theodorus E. Standaert | 2018-11-20 |
| 10109579 | Semiconductor device including a porous dielectric layer, and method of forming the semiconductor device | Lawrence A. Clevenger, Bartlet H. DeProspo, Huai Huang, Christopher J. Penny, Michael Rizzolo | 2018-10-23 |
| 10099108 | Dynamic rigidity mechanism | Lawrence A. Clevenger, Bartlet H. DeProspo, Michael Rizzolo | 2018-10-16 |
| 10090247 | Semiconductor device formed by wet etch removal of Ru selective to other metals | Cornelius Brown Peethala, David L. Rath | 2018-10-02 |
| 10083905 | Skip-vias bypassing a metallization level at minimum pitch | Lawrence A. Clevenger, Bartlet H. DeProspo, Huai Huang, Christopher J. Penny, Michael Rizzolo | 2018-09-25 |
| 10046698 | Smartwatch blackbox | Lawrence A. Clevenger, Leigh Anne H. Clevenger, Jonathan H. Connell, II, Nalini K. Ratha, Michael Rizzolo | 2018-08-14 |
| 10049974 | Metal silicate spacers for fully aligned vias | Jessica Dechene, Elbert E. Huang, Joe Lee | 2018-08-14 |
| 10049920 | Reduced tip-to-tip and via pitch at line end | Brent A. Anderson, Theodorus E. Standaert | 2018-08-14 |
| 10046601 | Smartwatch blackbox | Lawrence A. Clevenger, Leigh Anne H. Clevenger, Jonathan H. Connell, II, Nalini K. Ratha, Michael Rizzolo | 2018-08-14 |
| 10045096 | Social media modification of behavior and mobile screening for impairment | Lawrence A. Clevenger, Leigh Anne H. Clevenger, Jonathan H. Connell, II, Nalini K. Ratha, Michael Rizzolo | 2018-08-07 |
| 10020223 | Reduced tip-to-tip and via pitch at line end | Brent A. Anderson, Theodorus E. Standaert | 2018-07-10 |
| 10002831 | Selective and non-selective barrier layer wet removal | Elbert E. Huang, Raghuveer R. Patlolla, Cornelius Brown Peethala, David L. Rath, Hosadurga Shobha | 2018-06-19 |
| 9997451 | Semiconductor device including a porous dielectric layer, and method of forming the semiconductor device | Lawrence A. Clevenger, Bartlet H. DeProspo, Huai Huang, Christopher J. Penny, Michael Rizzolo | 2018-06-12 |
| 9984923 | Barrier layers in trenches and vias | Lawrence A. Clevenger, Cornelius Brown Peethala, Michael Rizzolo, Chih-Chao Yang | 2018-05-29 |
| 9984916 | Uniform dielectric recess depth during fin reveal | Lawrence A. Clevenger, Michael Rizzolo, Jay William Strane | 2018-05-29 |
| 9984935 | Uniform dielectric recess depth during fin reveal | Lawrence A. Clevenger, Michael Rizzolo, Jay William Strane | 2018-05-29 |
| 9985199 | Prevention of switching of spins in magnetic tunnel junctions by on-chip parasitic magnetic shield | Lawrence A. Clevenger, Nicholas Anthony Lanzillo, Michael Rizzolo, Theodorus E. Standaert | 2018-05-29 |
| 9966337 | Fully aligned via with integrated air gaps | Lawrence A. Clevenger, Huai Huang, Christopher J. Penny, Michael Rizzolo, Hosadurga Shobha | 2018-05-08 |
| 9953865 | Structure and method to improve FAV RIE process margin and electromigration | Joe Lee, Theodorus E. Standaert | 2018-04-24 |
| 9941211 | Reducing metallic interconnect resistivity through application of mechanical strain | Lawrence A. Clevenger, Nicholas Anthony Lanzillo, Michael Rizzolo, Theodorus E. Standaert | 2018-04-10 |
| 9941134 | Uniform dielectric recess depth during fin reveal | Lawrence A. Clevenger, Michael Rizzolo, Jay William Strane | 2018-04-10 |
| 9941088 | Fold over emitter and collector field emission transistor | Lawrence A. Clevenger, Michael Rizzolo | 2018-04-10 |
| 9929088 | Airgap protection layer for via alignment | Lawrence A. Clevenger, Christopher J. Penny, Michael Rizzolo | 2018-03-27 |