Issued Patents 2018
Showing 25 most recent of 28 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10150323 | Structure, system, method, and recording medium of implementing a directed self-assembled security pattern | Benjamin D. Briggs, Lawrence A. Clevenger, Bartlet H. DeProspo | 2018-12-11 |
| 10153202 | Neutral atom beam nitridation for copper interconnect | Benjamin D. Briggs, Lawrence A. Clevenger, Chih-Chao Yang | 2018-12-11 |
| 10134674 | Structure and method for improved stabilization of cobalt cap and/or cobalt liner in interconnects | Benjamin D. Briggs, James J. Kelly, Koichi Motoyama, Roger A. Quon, Theodorus E. Standaert | 2018-11-20 |
| 10109579 | Semiconductor device including a porous dielectric layer, and method of forming the semiconductor device | Benjamin D. Briggs, Lawrence A. Clevenger, Bartlet H. DeProspo, Huai Huang, Christopher J. Penny | 2018-10-23 |
| 10099108 | Dynamic rigidity mechanism | Benjamin D. Briggs, Lawrence A. Clevenger, Bartlet H. DeProspo | 2018-10-16 |
| 10096769 | Bottom electrode for MRAM applications | Prasad Bhosale, Raghuveer R. Patlolla, Chih-Chao Yang | 2018-10-09 |
| 10083905 | Skip-vias bypassing a metallization level at minimum pitch | Benjamin D. Briggs, Lawrence A. Clevenger, Bartlet H. DeProspo, Huai Huang, Christopher J. Penny | 2018-09-25 |
| 10046698 | Smartwatch blackbox | Benjamin D. Briggs, Lawrence A. Clevenger, Leigh Anne H. Clevenger, Jonathan H. Connell, II, Nalini K. Ratha | 2018-08-14 |
| 10046601 | Smartwatch blackbox | Benjamin D. Briggs, Lawrence A. Clevenger, Leigh Anne H. Clevenger, Jonathan H. Connell, II, Nalini K. Ratha | 2018-08-14 |
| 10045096 | Social media modification of behavior and mobile screening for impairment | Benjamin D. Briggs, Lawrence A. Clevenger, Leigh Anne H. Clevenger, Jonathan H. Connell, II, Nalini K. Ratha | 2018-08-07 |
| 10002762 | Multi-angled deposition and masking for custom spacer trim and selected spacer removal | Marc A. Bergendahl, Sean D. Burns, Lawrence A. Clevenger, Christopher J. Penny | 2018-06-19 |
| 9997451 | Semiconductor device including a porous dielectric layer, and method of forming the semiconductor device | Benjamin D. Briggs, Lawrence A. Clevenger, Bartlet H. DeProspo, Huai Huang, Christopher J. Penny | 2018-06-12 |
| 9984935 | Uniform dielectric recess depth during fin reveal | Benjamin D. Briggs, Lawrence A. Clevenger, Jay William Strane | 2018-05-29 |
| 9984916 | Uniform dielectric recess depth during fin reveal | Benjamin D. Briggs, Lawrence A. Clevenger, Jay William Strane | 2018-05-29 |
| 9984923 | Barrier layers in trenches and vias | Benjamin D. Briggs, Lawrence A. Clevenger, Cornelius Brown Peethala, Chih-Chao Yang | 2018-05-29 |
| 9985199 | Prevention of switching of spins in magnetic tunnel junctions by on-chip parasitic magnetic shield | Benjamin D. Briggs, Lawrence A. Clevenger, Nicholas Anthony Lanzillo, Theodorus E. Standaert | 2018-05-29 |
| 9966337 | Fully aligned via with integrated air gaps | Benjamin D. Briggs, Lawrence A. Clevenger, Huai Huang, Christopher J. Penny, Hosadurga Shobha | 2018-05-08 |
| 9941211 | Reducing metallic interconnect resistivity through application of mechanical strain | Benjamin D. Briggs, Lawrence A. Clevenger, Nicholas Anthony Lanzillo, Theodorus E. Standaert | 2018-04-10 |
| 9941134 | Uniform dielectric recess depth during fin reveal | Benjamin D. Briggs, Lawrence A. Clevenger, Jay William Strane | 2018-04-10 |
| 9941088 | Fold over emitter and collector field emission transistor | Benjamin D. Briggs, Lawrence A. Clevenger | 2018-04-10 |
| 9929088 | Airgap protection layer for via alignment | Benjamin D. Briggs, Lawrence A. Clevenger, Christopher J. Penny | 2018-03-27 |
| 9917137 | Integrated magnetic tunnel junction (MTJ) in back end of line (BEOL) interconnects | Benjamin D. Briggs, Theodorus E. Standaert | 2018-03-13 |
| 9911651 | Skip-vias bypassing a metallization level at minimum pitch | Benjamin D. Briggs, Lawrence A. Clevenger, Bartlet H. DeProspo, Huai Huang, Christopher J. Penny | 2018-03-06 |
| 9905459 | Neutral atom beam nitridation for copper interconnect | Benjamin D. Briggs, Lawrence A. Clevenger, Chih-Chao Yang | 2018-02-27 |
| 9899338 | Structure and fabrication method for enhanced mechanical strength crack stop | Benjamin D. Briggs, Lawrence A. Clevenger, Bartlet H. DeProspo, Huai Huang, Christopher J. Penny | 2018-02-20 |