Issued Patents 2018
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10134674 | Structure and method for improved stabilization of cobalt cap and/or cobalt liner in interconnects | Benjamin D. Briggs, Koichi Motoyama, Roger A. Quon, Michael Rizzolo, Theodorus E. Standaert | 2018-11-20 |
| 10128151 | Devices and methods of cobalt fill metallization | Vimal Kamineni, Praneet Adusumilli, Oscar van der Straten, Balasubramanian Pranatharthiharan | 2018-11-13 |
| 9966305 | Ion flow barrier structure for interconnect metallization | James J. Demarest, Koichi Motoyama, Christopher J. Penny, Oscar van der Straten | 2018-05-08 |