Issued Patents 2018
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10134674 | Structure and method for improved stabilization of cobalt cap and/or cobalt liner in interconnects | Benjamin D. Briggs, James J. Kelly, Roger A. Quon, Michael Rizzolo, Theodorus E. Standaert | 2018-11-20 |
| 9966305 | Ion flow barrier structure for interconnect metallization | James J. Demarest, James J. Kelly, Christopher J. Penny, Oscar van der Straten | 2018-05-08 |
| 9960078 | Reflow interconnect using Ru | Lawrence A. Clevenger, Su Chen Fan, Huai Huang, Wei Wang, Chih-Chao Yang | 2018-05-01 |