Issued Patents 2018
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 10128147 | Interconnect structure | Lawrence A. Clevenger, Roger A. Quon, Terry A. Spooner, Chih-Chao Yang | 2018-11-13 | $2,931,000 |
| 10068846 | Surface nitridation in metal interconnects | Lawrence A. Clevenger, Roger A. Quon, Terry A. Spooner, Chih-Chao Yang | 2018-09-04 | $2,923,000 |
| 9960078 | Reflow interconnect using Ru | Lawrence A. Clevenger, Su Chen Fan, Huai Huang, Koichi Motoyama, Chih-Chao Yang | 2018-05-01 | $4,480,000 |
| 9953864 | Interconnect structure | Lawrence A. Clevenger, Roger A. Quon, Terry A. Spooner, Chih-Chao Yang | 2018-04-24 | $2,845,000 |
| 9887160 | Multiple pre-clean processes for interconnect fabrication | Terry A. Spooner, Chih-Chao Yang | 2018-02-06 | $2,625,000 |