| 10121661 |
Self aligned pattern formation post spacer etchback in tight pitch configurations |
Sean D. Burns, Lawrence A. Clevenger, Matthew E. Colburn, Nelson Felix, Sivananda K. Kanakasabapathy +2 more |
2018-11-06 |
| 10109579 |
Semiconductor device including a porous dielectric layer, and method of forming the semiconductor device |
Benjamin D. Briggs, Lawrence A. Clevenger, Bartlet H. DeProspo, Huai Huang, Michael Rizzolo |
2018-10-23 |
| 10109455 |
System and method for performing nano beam diffraction analysis |
Marc A. Bergendahl, James J. Demarest, Roger QUON, Christopher J. Waskiewicz |
2018-10-23 |
| 10083864 |
Self aligned conductive lines with relaxed overlay |
Sean D. Burns, Lawrence A. Clevenger, Matthew E. Colburn, Sivananda K. Kanakasabapathy, Yann Mignot +2 more |
2018-09-25 |
| 10083908 |
BEOL vertical fuse formed over air gap |
Marc A. Bergendahl, James J. Demarest, Christopher J. Waskiewicz |
2018-09-25 |
| 10083905 |
Skip-vias bypassing a metallization level at minimum pitch |
Benjamin D. Briggs, Lawrence A. Clevenger, Bartlet H. DeProspo, Huai Huang, Michael Rizzolo |
2018-09-25 |
| 10056290 |
Self-aligned pattern formation for a semiconductor device |
Sean D. Burns, Lawrence A. Clevenger, Nelson Felix, Sivananda K. Kanakasabapathy, Nicole Saulnier |
2018-08-21 |
| 10002762 |
Multi-angled deposition and masking for custom spacer trim and selected spacer removal |
Marc A. Bergendahl, Sean D. Burns, Lawrence A. Clevenger, Michael Rizzolo |
2018-06-19 |
| 9997451 |
Semiconductor device including a porous dielectric layer, and method of forming the semiconductor device |
Benjamin D. Briggs, Lawrence A. Clevenger, Bartlet H. DeProspo, Huai Huang, Michael Rizzolo |
2018-06-12 |
| 9997454 |
BEOL vertical fuse formed over air gap |
Marc A. Bergendahl, James J. Demarest, Christopher J. Waskiewicz |
2018-06-12 |
| 9991156 |
Self-aligned quadruple patterning (SAQP) for routing layouts including multi-track jogs |
Sean D. Burns, Lawrence A. Clevenger, Matthew E. Colburn, Sivananda K. Kanakasabapathy, Yann Mignot +2 more |
2018-06-05 |
| 9978560 |
System and method for performing nano beam diffraction analysis |
Marc A. Bergendahl, James J. Demarest, Roger QUON, Christopher J. Waskiewicz |
2018-05-22 |
| 9972533 |
Aligning conductive vias with trenches |
Sean D. Burns, Lawrence A. Clevenger, Matthew E. Colburn, Sivananda K. Kanakasabapathy, Yann Mignot +2 more |
2018-05-15 |
| 9966337 |
Fully aligned via with integrated air gaps |
Benjamin D. Briggs, Lawrence A. Clevenger, Huai Huang, Michael Rizzolo, Hosadurga Shobha |
2018-05-08 |
| 9966305 |
Ion flow barrier structure for interconnect metallization |
James J. Demarest, James J. Kelly, Koichi Motoyama, Oscar van der Straten |
2018-05-08 |
| 9960117 |
Air gap semiconductor structure with selective cap bilayer |
Stephen M. Gates, Elbert E. Huang, Dimitri Kioussis, Deepika Priyadarshini |
2018-05-01 |
| 9934970 |
Self aligned pattern formation post spacer etchback in tight pitch configurations |
Sean D. Burns, Lawrence A. Clevenger, Matthew E. Colburn, Nelson Felix, Sivananda K. Kanakasabapathy +2 more |
2018-04-03 |
| 9929088 |
Airgap protection layer for via alignment |
Benjamin D. Briggs, Lawrence A. Clevenger, Michael Rizzolo |
2018-03-27 |
| 9911647 |
Self aligned conductive lines |
Sean D. Burns, Lawrence A. Clevenger, Anuja E. DeSilva, Nelson Felix, Sivananda K. Kanakasabapathy +3 more |
2018-03-06 |
| 9911651 |
Skip-vias bypassing a metallization level at minimum pitch |
Benjamin D. Briggs, Lawrence A. Clevenger, Bartlet H. DeProspo, Huai Huang, Michael Rizzolo |
2018-03-06 |
| 9905513 |
Selective blocking boundary placement for circuit locations requiring electromigration short-length |
Benjamin D. Briggs, Elbert E. Huang, Joe Lee |
2018-02-27 |
| 9899338 |
Structure and fabrication method for enhanced mechanical strength crack stop |
Benjamin D. Briggs, Lawrence A. Clevenger, Bartlet H. DeProspo, Huai Huang, Michael Rizzolo |
2018-02-20 |
| 9899256 |
Self-aligned airgaps with conductive lines and vias |
Benjamin D. Briggs, Lawrence A. Clevenger, Bartlet H. DeProspo, Huai Huang, Michael Rizzolo |
2018-02-20 |
