Issued Patents 2018
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10134577 | Edge trim processes and resultant structures | Richard F. Indyk, Spyridon Skordas, Edmund J. Sprogis, Anthony K. Stamper, Kevin R. Winstel | 2018-11-20 |
| 9960117 | Air gap semiconductor structure with selective cap bilayer | Stephen M. Gates, Elbert E. Huang, Dimitri Kioussis, Christopher J. Penny | 2018-05-01 |
| 9947579 | Copper interconnect structure with manganese oxide barrier layer | Daniel C. Edelstein, Son V. Nguyen, Takeshi Nogami, Hosadurga Shobha | 2018-04-17 |
| 9947581 | Method of forming a copper based interconnect structure | Daniel C. Edelstein, Son V. Nguyen, Takeshi Nogami, Hosadurga Shobha | 2018-04-17 |
| 9947622 | Ultrathin superlattice of MnO/Mn/MnN and other metal oxide/metal/metal nitride liners and caps for copper low dielectric constant interconnects | Donald F. Canaperi, Daniel C. Edelstein, Alfred Grill, Son V. Nguyen, Takeshi Nogami +1 more | 2018-04-17 |
| 9934963 | Multilayer dielectric structures with graded composition for nano-scale semiconductor devices | Son V. Nguyen | 2018-04-03 |