Issued Patents 2018
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10157757 | Gas-controlled bonding platform for edge defect reduction during wafer bonding | Wei Lin, Robert R. Young | 2018-12-18 |
| 10134577 | Edge trim processes and resultant structures | Richard F. Indyk, Deepika Priyadarshini, Edmund J. Sprogis, Anthony K. Stamper, Kevin R. Winstel | 2018-11-20 |
| 10056272 | Gas-controlled bonding platform for edge defect reduction during wafer bonding | Wei Lin, Robert R. Young | 2018-08-21 |
| 10020279 | Semiconductor device including built-in crack-arresting film structure | Wei Lin, Leathen Shi, Kevin R. Winstel | 2018-07-10 |
| 9922851 | Gas-controlled bonding platform for edge defect reduction during wafer bonding | Wei Lin, Robert R. Young | 2018-03-20 |
| 9881896 | Advanced chip to wafer stacking | Wei Lin | 2018-01-30 |