Issued Patents 2018
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10157757 | Gas-controlled bonding platform for edge defect reduction during wafer bonding | Wei Lin, Spyridon Skordas | 2018-12-18 |
| 10056272 | Gas-controlled bonding platform for edge defect reduction during wafer bonding | Wei Lin, Spyridon Skordas | 2018-08-21 |
| 9922851 | Gas-controlled bonding platform for edge defect reduction during wafer bonding | Wei Lin, Spyridon Skordas | 2018-03-20 |