Issued Patents 2018
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 10157757 | Gas-controlled bonding platform for edge defect reduction during wafer bonding | Spyridon Skordas, Robert R. Young | 2018-12-18 | $3,830,000 |
| 10056272 | Gas-controlled bonding platform for edge defect reduction during wafer bonding | Spyridon Skordas, Robert R. Young | 2018-08-21 | $2,787,000 |
| 10047264 | Polymer composite thermal interface material with high thermal conductivity | — | 2018-08-14 | $4,051,000 |
| 10020279 | Semiconductor device including built-in crack-arresting film structure | Leathen Shi, Spyridon Skordas, Kevin R. Winstel | 2018-07-10 | $4,870,000 |
| 9922851 | Gas-controlled bonding platform for edge defect reduction during wafer bonding | Spyridon Skordas, Robert R. Young | 2018-03-20 | $2,525,000 |
| 9881896 | Advanced chip to wafer stacking | Spyridon Skordas | 2018-01-30 | $2,622,000 |