Issued Patents 2018
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9947579 | Copper interconnect structure with manganese oxide barrier layer | Daniel C. Edelstein, Son V. Nguyen, Deepika Priyadarshini, Hosadurga Shobha | 2018-04-17 |
| 9947581 | Method of forming a copper based interconnect structure | Daniel C. Edelstein, Son V. Nguyen, Deepika Priyadarshini, Hosadurga Shobha | 2018-04-17 |
| 9947622 | Ultrathin superlattice of MnO/Mn/MnN and other metal oxide/metal/metal nitride liners and caps for copper low dielectric constant interconnects | Donald F. Canaperi, Daniel C. Edelstein, Alfred Grill, Son V. Nguyen, Deepika Priyadarshini +1 more | 2018-04-17 |
| 9881833 | Barrier planarization for interconnect metallization | Benjamin D. Briggs, Elbert E. Huang, Raghuveer R. Patlolla, Cornelius Brown Peethala, David L. Rath | 2018-01-30 |