| 10090247 |
Semiconductor device formed by wet etch removal of Ru selective to other metals |
Benjamin D. Briggs, Cornelius Brown Peethala |
2018-10-02 |
| 10074562 |
Self aligned contact structure |
Rosa A. Orozco-Teran, Ravikumar Ramachandran, John A. Fitzsimmons, Russell H. Arndt |
2018-09-11 |
| 10049802 |
Patterning magnetic films using self-stop electro-etching |
Eugene J. O'Sullivan, Naigang Wang |
2018-08-14 |
| 10043663 |
Enhanced defect reduction for heteroepitaxy by seed shape engineering |
Cheng-Wei Cheng, Devendra K. Sadana, Kuen-Ting Shiu, Brent A. Wacaser |
2018-08-07 |
| 10002831 |
Selective and non-selective barrier layer wet removal |
Benjamin D. Briggs, Elbert E. Huang, Raghuveer R. Patlolla, Cornelius Brown Peethala, Hosadurga Shobha |
2018-06-19 |
| 9911690 |
Interconnect structures with fully aligned vias |
Daniel C. Edelstein, Nicholas C. M. Fuller, Elbert E. Huang, Satyanarayana V. Nitta |
2018-03-06 |
| 9881833 |
Barrier planarization for interconnect metallization |
Benjamin D. Briggs, Elbert E. Huang, Takeshi Nogami, Raghuveer R. Patlolla, Cornelius Brown Peethala |
2018-01-30 |
