Issued Patents 2018
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10134633 | Self-aligned contact with CMP stop layer | Stan Tsai, Ruilong Xie | 2018-11-20 |
| 10128151 | Devices and methods of cobalt fill metallization | James J. Kelly, Praneet Adusumilli, Oscar van der Straten, Balasubramanian Pranatharthiharan | 2018-11-13 |
| 10043708 | Structure and method for capping cobalt contacts | Viraj Y. Sardesai, Suraj K. Patil, Scott Beasor | 2018-08-07 |
| 10026693 | Method, apparatus, and system for MOL interconnects without titanium liner | Mark V. Raymond, Praneet Adusumilli, Chengyu Niu | 2018-07-17 |
| 10020260 | Corrosion and/or etch protection layer for contacts and interconnect metallization integration | Shafaat Ahmed, Benjamin G. Moser, Dinesh R. Koli, Vishal Chhabra | 2018-07-10 |
| 10014180 | Tungsten gate and method for forming | Neal A. Makela, Pei Liu, Chih-Chiang Chang | 2018-07-03 |
| 9917009 | Methods of forming a through-substrate-via (TSV) and a metallization layer after formation of a semiconductor device | Himani Suhag Kamineni, Daniel M. Smith, Maxwell Lippitt | 2018-03-13 |
| 9905473 | Self-aligned contact etch for fabricating a FinFET | Guillaume Bouche, Michael V. Aquilino | 2018-02-27 |
| 9859217 | Middle of the line (MOL) metal contacts | Chengyu Niu, Mark V. Raymond, Xunyuan Zhang | 2018-01-02 |