Issued Patents 2018
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9917009 | Methods of forming a through-substrate-via (TSV) and a metallization layer after formation of a semiconductor device | Vimal Kamineni, Daniel M. Smith, Maxwell Lippitt | 2018-03-13 |