| 10157789 |
Via formation using sidewall image transfer process to define lateral dimension |
Shyng-Tsong Chen, Cheng Chi, Chi-Chun Liu, Sylvie Mignot, Hosadurga Shobha +3 more |
2018-12-18 |
| 10103022 |
Alternating hardmasks for tight-pitch line formation |
John C. Arnold, Anuja E. DeSilva, Nelson Felix, Chi-Chun Liu, Stuart A. Sieg |
2018-10-16 |
| 10090164 |
Hard masks for block patterning |
Ekmini Anuja De Silva, Isabel C. Estrada-Raygoza, Indira Seshadri, Yongan Xu |
2018-10-02 |
| 10043744 |
Avoiding gate metal via shorting to source or drain contacts |
Victor Chan, Xuefeng Liu, Yongan Xu |
2018-08-07 |
| 10037922 |
Co-integration of tensile silicon and compressive silicon germanium |
Nicolas Loubet, Pierre Morin |
2018-07-31 |
| 10032632 |
Selective gas etching for self-aligned pattern transfer |
John C. Arnold, Sean D. Burns, Yongan Xu |
2018-07-24 |
| 10032633 |
Image transfer using EUV lithographic structure and double patterning process |
Hsueh-Chung Chen, Yongan Xu |
2018-07-24 |
| 10020255 |
Integration of super via structure in BEOL |
Ruqiang Bao, Joe Lee, Hosadurga Shobha, Junli Wang, Yongan Xu |
2018-07-10 |
| 10020254 |
Integration of super via structure in BEOL |
Ruqiang Bao, Joe Lee, Hosadurga Shobha, Junli Wang, Yongan Xu |
2018-07-10 |
| 9984919 |
Inverted damascene interconnect structures |
Xunyuan Zhang, Chanro Park, Yongan Xu, Peng Xu |
2018-05-29 |
| 9916986 |
Single or mutli block mask management for spacer height and defect reduction for BEOL |
Benjamin D. Briggs, Lawrence A. Clevenger |
2018-03-13 |
| 9905478 |
Co-integration of tensile silicon and compressive silicon germanium |
Nicolas Loubet, Pierre Morin |
2018-02-27 |
| 9859426 |
Semiconductor device including optimized elastic strain buffer |
Nicolas Loubet, Pierre Morin |
2018-01-02 |
