Issued Patents 2018
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10164060 | Work function metal fill for replacement gate fin field effect transistor process | Hong He, Junli Wang, Yunpeng Yin | 2018-12-25 |
| 10157789 | Via formation using sidewall image transfer process to define lateral dimension | Shyng-Tsong Chen, Cheng Chi, Chi-Chun Liu, Sylvie Mignot, Yann Mignot +3 more | 2018-12-18 |
| 10147803 | Work function metal fill for replacement gate fin field effect transistor process | Hong He, Junli Wang, Yunpeng Yin | 2018-12-04 |
| 10090164 | Hard masks for block patterning | Ekmini Anuja De Silva, Isabel C. Estrada-Raygoza, Yann Mignot, Indira Seshadri | 2018-10-02 |
| 10043744 | Avoiding gate metal via shorting to source or drain contacts | Victor Chan, Xuefeng Liu, Yann Mignot | 2018-08-07 |
| 10032633 | Image transfer using EUV lithographic structure and double patterning process | Hsueh-Chung Chen, Yann Mignot | 2018-07-24 |
| 10032632 | Selective gas etching for self-aligned pattern transfer | John C. Arnold, Sean D. Burns, Yann Mignot | 2018-07-24 |
| 10020255 | Integration of super via structure in BEOL | Ruqiang Bao, Joe Lee, Yann Mignot, Hosadurga Shobha, Junli Wang | 2018-07-10 |
| 10020254 | Integration of super via structure in BEOL | Ruqiang Bao, Joe Lee, Yann Mignot, Hosadurga Shobha, Junli Wang | 2018-07-10 |
| 9991365 | Forming vertical transport field effect transistors with uniform bottom spacer thickness | Kangguo Cheng, Xuefeng Liu, Peng Xu | 2018-06-05 |
| 9984919 | Inverted damascene interconnect structures | Xunyuan Zhang, Chanro Park, Peng Xu, Yann Mignot | 2018-05-29 |