Issued Patents 2016
Showing 25 most recent of 39 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9527723 | Semiconductor device and method of forming microelectromechanical systems (MEMS) package | Won Kyoung Choi, Kang Chen, Ivan Micallef | 2016-12-27 |
| 9524955 | Semiconductor device and method of forming no-flow underfill material around vertical interconnect structure | Rui Huang, Heap Hoe Kuan, Seng Guan Chow | 2016-12-20 |
| 9520365 | Semiconductor device and method for forming semiconductor package having build-up interconnect structure over semiconductor die with different CTE insulating layers | Kang Chen, Yu Gu, Wei Meng, Chee Siang Ong | 2016-12-13 |
| 9508626 | Semiconductor device and method of forming openings in thermally-conductive frame of FO-WLCSP to dissipate heat and reduce package height | Reza A. Pagaila | 2016-11-29 |
| 9508621 | Semiconductor device and method of forming compliant stress relief buffer around large array WLCSP | Il Kwon Shim, Seng Guan Chow | 2016-11-29 |
| 9496195 | Semiconductor device and method of depositing encapsulant along sides and surface edge of semiconductor die in embedded WLCSP | Heinz-Peter Wirtz, Seung Wook Yoon, Pandi C. Marimuthu | 2016-11-15 |
| 9484259 | Semiconductor device and method of forming protection and support structure for conductive interconnect structure | Kang Chen, Jianmin Fang | 2016-11-01 |
| 9472452 | Semiconductor device and method of forming repassivation layer with reduced opening to contact pad of semiconductor die | Kang Chen, Jianmin Fang, Xia Feng | 2016-10-18 |
| 9466577 | Semiconductor interconnect structure with stacked vias separated by signal line and method therefor | — | 2016-10-11 |
| 9460951 | Semiconductor device and method of wafer level package integration | — | 2016-10-04 |
| 9449925 | Integrated passive devices | Haijing Cao, Qing Zhang, Kang Chen, Jianmin Fang | 2016-09-20 |
| 9449943 | Semiconductor device and method of balancing surfaces of an embedded PCB unit with a dummy copper pattern | Kang Chen, Hin Hwa Goh, II Kwon Shim | 2016-09-20 |
| 9443797 | Semiconductor device having wire studs as vertical interconnect in FO-WLP | Pandi C. Marimuthu, Sheila Marie L. Alvarez, Jose Alvin Caparas, Yang Tan | 2016-09-13 |
| 9437552 | Semiconductor device and method of forming insulating layer around semiconductor die | Kang Chen, Jianmin Fang, Xia Feng, Xusheng Bao | 2016-09-06 |
| 9437538 | Semiconductor device including RDL along sloped side surface of semiconductor die for Z-direction interconnect | Reza A. Pagaila, Jun Mo Koo | 2016-09-06 |
| 9418878 | Semiconductor device and method of forming adhesive material to secure semiconductor die to carrier in WLCSP | Reza A. Pagaila | 2016-08-16 |
| 9401331 | Semiconductor device and method of forming a vertical interconnect structure for 3-D FO-WLCSP | Xusheng Bao, Kang Chen, Jianmin Fang | 2016-07-26 |
| 9385009 | Semiconductor device and method of forming stacked vias within interconnect structure for Fo-WLCSP | Rui Huang, Kang Cheng, Gu Yu | 2016-07-05 |
| 9385006 | Semiconductor device and method of forming an embedded SOP fan-out package | Kang Chen | 2016-07-05 |
| 9385052 | Semiconductor device and method of forming build-up interconnect structures over carrier for testing at interim stages | Kang Chen | 2016-07-05 |
| 9385102 | Semiconductor device and method of forming supporting layer over semiconductor die in thin fan-out wafer level chip scale package | Kang Chen, Yu Gu | 2016-07-05 |
| 9368563 | Semiconductor device including integrated passive device formed over semiconductor die with conductive bridge and fan-out redistribution layer | Kai Liu, Kang Chen | 2016-06-14 |
| 9349723 | Semiconductor device and method of forming passive devices | Haijing Cao, Qing Zhang, Robert C. Frye | 2016-05-24 |
| 9343396 | Semiconductor device and method of forming IPD in fan-out wafer level chip scale package | Robert C. Frye, Pandi C. Marimuthu, Kai Liu | 2016-05-17 |
| 9337141 | Method of forming an inductor on a semiconductor wafer | Haijing Cao, Qing Zhang | 2016-05-10 |