Issued Patents 2016
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9502267 | Integrated circuit packaging system with support structure and method of manufacture thereof | HeeJo Chi, Bartholomew Liao Chung Foh, Zigmund Ramirez Camacho, Dao Nguyen Phu Cuong | 2016-11-22 |
| 9443797 | Semiconductor device having wire studs as vertical interconnect in FO-WLP | Pandi C. Marimuthu, Yaojian Lin, Jose Alvin Caparas, Yang Tan | 2016-09-13 |
| 9406531 | Integrated circuit packaging system with photoimagable dielectric-defined trace and method of manufacture thereof | Zigmund Ramirez Camacho, Bartholomew Liao Chung Foh, Dao Nguyen Phu Cuong, HeeJo Chi | 2016-08-02 |
| 9406642 | Integrated circuit packaging system with insulated trace and method of manufacture thereof | HeeJo Chi, Bartholomew Liao Chung Foh, Zigmund Ramirez Camacho, Dao Nguyen Phu Cuong | 2016-08-02 |
| 9330994 | Semiconductor device and method of forming RDL and vertical interconnect by laser direct structuring | Zigmund Ramirez Camacho, Bartholomew Liao, HeeJo Chi, Kelvin Dao | 2016-05-03 |
| 9331003 | Integrated circuit packaging system with pre-molded leadframe and method of manufacture thereof | Zigmund Ramirez Camacho, Bartholomew Liao Chung Foh, Dao Nguyen Phu Cuong, HeeJo Chi | 2016-05-03 |