Issued Patents 2016
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9443797 | Semiconductor device having wire studs as vertical interconnect in FO-WLP | Pandi C. Marimuthu, Sheila Marie L. Alvarez, Yaojian Lin, Yang Tan | 2016-09-13 |
| 9293401 | Semiconductor device and method for forming a low profile embedded wafer level ball grid array molded laser package (EWLP-MLP) | Seung Wook Yoon, Yaojian Lin, Pandi C. Marimuthu, Kang Chen, Xusheng Bao +1 more | 2016-03-22 |
| 9281259 | Semiconductor device and method of forming thick encapsulant for stiffness with recesses for stress relief in FO-WLCSP | Yaojian Lin, Kang Chen, Glenn Omandam | 2016-03-08 |