| 9478485 |
Semiconductor device and method of stacking semiconductor die on a fan-out WLCSP |
KwokKeung Szeto |
2016-10-25 |
| 9437552 |
Semiconductor device and method of forming insulating layer around semiconductor die |
Yaojian Lin, Kang Chen, Jianmin Fang, Xia Feng |
2016-09-06 |
| 9401331 |
Semiconductor device and method of forming a vertical interconnect structure for 3-D FO-WLCSP |
Yaojian Lin, Kang Chen, Jianmin Fang |
2016-07-26 |
| 9397058 |
Semiconductor device and method of forming patterned repassivation openings between RDL and UBM to reduce adverse effects of electro-migration |
Ma Phoo Pwint Hlaing, Jian Zuo |
2016-07-19 |
| 9293401 |
Semiconductor device and method for forming a low profile embedded wafer level ball grid array molded laser package (EWLP-MLP) |
Seung Wook Yoon, Jose Alvin Caparas, Yaojian Lin, Pandi C. Marimuthu, Kang Chen +1 more |
2016-03-22 |
| 9252172 |
Semiconductor device and method of forming EWLB semiconductor package with vertical interconnect structure and cavity region |
Seng Guan Chow, Lee Sun Lim, Rui Huang, Ma Phoo Pwint Hlaing |
2016-02-02 |
| 9236278 |
Integrated circuit packaging system with a substrate embedded dummy-die paddle and method of manufacture thereof |
Rui Huang, Kang Chen, Yung Kuan Hsiao, Hin Hwa Goh |
2016-01-12 |