Issued Patents 2016
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9524955 | Semiconductor device and method of forming no-flow underfill material around vertical interconnect structure | Heap Hoe Kuan, Yaojian Lin, Seng Guan Chow | 2016-12-20 |
| 9515016 | Semiconductor package and method of forming z-direction conductive posts embedded in structurally protective encapsulant | Il Kwon Shim, Seng Guan Chow, Heap Hoe Kuan | 2016-12-06 |
| 9508623 | Semiconductor packages and methods of packaging semiconductor devices | Nathapong Suthiwongsunthorn, Antonio Jr. Bambalan Dimaano, Hua Tan, Kriangsak Sae Le, Beng Yeung Ho +3 more | 2016-11-29 |
| 9385009 | Semiconductor device and method of forming stacked vias within interconnect structure for Fo-WLCSP | Yaojian Lin, Kang Cheng, Gu Yu | 2016-07-05 |
| 9293350 | Semiconductor package system with cavity substrate and manufacturing method therefor | Seng Guan Chow, Heap Hoe Kuan | 2016-03-22 |
| 9275877 | Semiconductor device and method of forming semiconductor package using panel form carrier | Yaojian Lin, Heap Hoe Kuan, Seng Guan Chow | 2016-03-01 |
| 9257356 | Semiconductor device and method of forming an IPD beneath a semiconductor die with direct connection to external devices | Heap Hoe Kuan, Yaojian Lin, Seng Guan Chow | 2016-02-09 |
| 9252172 | Semiconductor device and method of forming EWLB semiconductor package with vertical interconnect structure and cavity region | Seng Guan Chow, Lee Sun Lim, Xusheng Bao, Ma Phoo Pwint Hlaing | 2016-02-02 |
| 9236278 | Integrated circuit packaging system with a substrate embedded dummy-die paddle and method of manufacture thereof | Xusheng Bao, Kang Chen, Yung Kuan Hsiao, Hin Hwa Goh | 2016-01-12 |