Issued Patents 2016
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9508623 | Semiconductor packages and methods of packaging semiconductor devices | Antonio Jr. Bambalan Dimaano, Rui Huang, Hua Tan, Kriangsak Sae Le, Beng Yeung Ho +3 more | 2016-11-29 |
| 9472532 | Leadframe area array packaging technology | Antonio B. Dimaano, Jr., Yong Bo Yang | 2016-10-18 |
| 9443762 | Semiconductor device and method of forming a thin wafer without a carrier | Pandi C. Marimuthu, Shuangwu Huang | 2016-09-13 |
| 9236352 | Semiconductor die and method of forming noise absorbing regions between THVs in peripheral region of the die | Reza A. Pagaila, Byung Tai Do, Shuangwu Huang, Dioscoro A. Merilo | 2016-01-12 |